PRE FABRICATED METAL BUILDING ASSEMBLY KITS

Brand Owner (click to sort) Address Description
ECOSHAPE BOSCH REXROTH AG Heidehofstrasse 31 Stuttgart 70184 Germany Pre-fabricated metal building assembly kits comprised of two profiles with caps, threaded sleeve fasteners and related adaptors; pipes and tubes of metal in particular extruded pipes and tubes of aluminum; pipe connectors of metal; metal building materials, namely, metal attachment components for load bearing, frame and protective constructions, in particular plates, expansion joint bases for floors and walls, deflecting and pedestal rollers and end pieces for building floors and walls; metal hardware, namely, metal screws, nuts, bolts, brackets for general use, profiles for prefabricated metal building assembly kits, tubes and pipes;
HURRICANE DEFENDER Kemko, Inc. 27153 N. Pollard Road Daphne AL 36526 Pre-fabricated metal building assembly kits; Prefabricated buildings made substantially of metal; Prefabricated metal buildings;HURRICANE;
LOGISTX BLUESCOPE BUILDINGS NORTH AMERICA, INC. 1540 Genessee Street Kansas City MO 64102 Pre-fabricated metal building assembly kits; Prefabricated buildings made substantially of metal;
SYMPHONY DECK casata technologies inc. 25 Industrial Court B Sault Ste. Marie P6B5Z9 Canada Pre-fabricated metal building assembly kits;DECK;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method of protecting metal traces and contacts on a fabricated semiconductor wafer from mechanical damage during dicing of the fabricated wafer, where the metal traces and contacts form electrical connections with an active device region of the semiconductor. The method includes the steps of providing a group of discrete metal deposits adjacent the metal traces and contacts, wherein said metal deposits are substantially not contiguously connected to each other or to any traces or contacts of the active device regions of semiconductor die, attaching the fabricated wafer to an adhesive tape used for securing the fabricated wafer during a die separation process, separating the die from the fabricated wafer while attached to the adhesive tape and removing the die from the adhesive tape.