PRECISION WAFERING MACHINE INCLUDING ABRASIVE

Brand Owner Address Description
CAPCO GENERAL SIGNAL CORPORATION New York NY precision wafering machine including abrasive blades, blade tensioning head motorized billet positioning accessory and automatic wafer removal system for use therewith; thin sectioning machine and abrasive blades for use therewith;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. An abrasive pad for a manual grinding machine, in particular for an eccentric grinder, has a flat contact surface (13) on which an abrasive sheet is placed, and attachment means located on the contact surface (13) for creating an adhesive connection with the abrasive sheet. To reduce the production costs of the abrasive pad, it is made entirely-including the attachment means-of plastic using a single-component injection molding procedure, whereby the attachment means are designed preferably as hook-type fasteners (18) which extend out of the contact surface (13) (FIG. 1).