PREPARATION FOR RELIEVING TEETHING PAINS

Brand Owner Address Description
TOOTH-AID PUREPAC LABORATORIES CORPORATION 200 ELMORA AVE. ELIZABETH NJ 07207 PREPARATION FOR RELIEVING TEETHING PAINS AND TOOTHACHE;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The present invention is a semiconductor device capable of relieving thermal stress without breaking wire. It comprises a semiconductor chip (12), a solder ball (20) for external connection, wiring (18) for electrically connecting the semiconductor chip (12) and the solder ball (20), a stress relieving layer (16) provided on the semiconductor chip (12), and a stress transmission portion (22) for transmitting stress from the solder ball (20) to the stress relieving layer (16) in a peripheral position of an electrical connection portion (24a) of the solder ball (20) and wiring (18).