PRINTED WIRING BOARDS

Brand Owner (click to sort) Address Description
BLA SUMITOMO BAKELITE CO., LTD. 5-8 Higashi-shinagawa 2-chome Shinagawa-ku, Tokyo 140-0002 Japan Printed wiring boards; multilayer printed wiring boards;Semi-worked plastic products in the form of boards, plates, foils, films, and sheets; laminated plastic composite materials in the form of boards for use in manufacturing; electrical insulating materials;
COCOMI TOYOBO CO., LTD. 13-1, Umeda 1-chome, Kita-ku Osaka-shi, Osaka 5300001 Japan Printed wiring boards, namely, printed circuit boards; magnetic cores; resistance wires; electrodes; parts for electrodes; electronic apparatus for testing the electrical conductivity of electrodes and electrocardiographs; electric wires and cables; electrodes and electric wires in the form of conductive sheets; electrical conductors, namely, conductive paste;Rubber layered conductive sheets containing electrodes and electric wires; resin layered conductive sheets containing electrodes and electric wires for general industrial use; semi-processed resins;Electrodes for medical use; electrocardiographs; parts for electrocardiographs; medical apparatus and instruments for monitoring vital signs;
COMPOSITECH COMPOSITECH LTD. 120 Ricefield Lane Hauppauge NY 117882008 printed wiring boards;COMPOSITE TECHNOLOGY;
IC INTRA-CON Dynatech Corp. 1225 E. WAKEHAM AVE. Santa Ana CA 92702 Printed Wiring Boards;No claim is made to the exclusive right to use IC, apart from the mark as shown.;Custom Manufacturing and Assembly of Electrical Components and Printed Wiring Boards;Testing of Electrical Components and Printing Wiring Boards;
L XY SUMITOMO BAKELITE CO., LTD. 5-8 Higashi-shinagawa 2-chome Shinagawa-ku, Tokyo 140-0002 Japan Printed wiring boards; multilayer printed wiring boards;In the statement, Column 1, line 12 FIR should be deleted, and FOR should be inserted.;Plastic semi-worked products, namely, semi-processed plastics in the form of films, sheets and boards for use as material for manufacturing electric and electronic goods; plastic laminated boards for use in manufacture of electric goods and electronic devices; electrical insulating materials;LAXY;Color is not claimed as a feature of the mark.;The wording LAXYor L@XY has no significance in a foreign language.;
L Z SUMITOMO BAKELITE CO., LTD. 5-8 Higashi-shinagawa 2-chome Shinagawa-ku, Tokyo 140-0002 Japan Printed wiring boards; multilayer printed wiring boards;Plastic semi-worked products, namely, semi-processed plastics in the form of films, sheets and boards for use as material for manufacturing electric and electronic goods; plastic laminated boards for use in manufacture of electric goods and electronic devices; electrical insulating materials;LAZ;Color is not claimed as a feature of the mark.;The tansliteration of the non-Latin characters in the mark is: L ALPHA Z.;The wording LAZ or L@Z has no significance in a foreign language.;
L.O.W. CONDOR D.C. POWER SUPPLIES, INC. 4880 ADOHR LANE CAMARILLO, CALIFORNIA CA 93010 PRINTED WIRING BOARDS, D.C. POWER SUPPLIES, TRANSFORMERS, CHASSIS;LOW;
LAZ SUMITOMO BAKELITE CO., LTD. 5-8 Higashi-shinagawa 2-chome Shinagawa-ku, Tokyo 140-0002 Japan Printed wiring boards; multilayer printed wiring boards;Semi-worked plastic products in the form of boards, plates, foils, films, and sheets; laminated plastic composite materials in the form of boards for use in manufacturing; electrical insulating materials;
LCA JACK G. LAWRENCE, DOING BUSINESS AS LAWRENCE'S CIRCUIT ART 210 E. EMERSON AVE. ORANGE, CALIF. 92665 NEWPORT BEACH CA 92665 PRINTED WIRING BOARDS;
LCA Lawrence; Jack G. Orange CA PRINTED WIRING BOARDS;
PWS KineticSystems Corporation 11 Maryknoll Dr. Lockport IL 60441 Printed Wiring Boards;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. An electronics packaging assembly (100) includes: an assembly housing (120); a plurality of printed circuit boards (110; 210) arranged in parallel within the assembly housing (120); and a vibration stiffener (140; 240). The printed circuit boards (110; 210) each have a notch (112; 212) on one edge. The vibration stiffener (140; 240) is arranged within the assembly housing (120) along a lateral direction relative to the plurality of printed circuit boards (110; 210) and includes a plurality of slots (142; 242) that engage with corresponding notches (112; 212) of the plurality of printed circuit boards (110; 210), wherein engagement of the vibration stiffener (140; 240) with the plurality of printed circuit boards (110; 210) limits flexing of the printed circuit boards (110; 210) in the lateral direction. In one implementation, a portion of the assembly housing (120) contacts and applies pressure to the vibration stiffener (140; 240) to keep the vibration stiffener (140; 240) in place.