PULSE FORMING NETWORKS

Brand	Owner (click to sort)	Address	Description
CAPITRON	AMP INCORPORATED	P.O. BOX 3608 HARRISBURG PA 17105	PULSE FORMING NETWORKS, TRANSFORMERS, MODULATORS, DELAY LINES, ELECTRICAL LEADS, AND ELECTRICAL CONNECTORS;
SPRAGUE	VISHAY SPRAGUE, INC.	2813 West Road Bennington VT 05201	[PULSE FORMING NETWORKS, RADIO INTERFERENCE LOCATORS, CAPACITANCE BRIDGES, CAPACITOR ANALYZERS, AND EQUIPMENT FOR ASSEMBLING AND TESTING OF SEMICONDUCTOR DEVICES];CAPACITORS[, RESISTORS, INDUCTORS, MAGNETIC AMPLIFIERS, DELAY LINES, PULSE TRANSFORMERS,] [ MAGNETIC CORES, ] [MAGNETIC SHIFT REGISTERS, RADIO INTERFERENCE FILTERS, AND OTHER TYPES OF ELECTRICAL WAVE FILTERS; SEMICONDUCTOR DEVICES-NAMELY, TRANSISTORS; DIODES AND INTEGRATED CIRCUITS; PACKAGED ELECTRICAL AND ELECTRONIC CIRCUITS-NAMELY, CIRCUIT MODULES,] [ THIN-FILM AND ] [THICK-FILM PASSIVE AND HYBRID CIRCUITS,] [ PIEZO-ELECTRIC TRANSDUCERS AND HYDROPHONE ASSEMBLIES, ] [CERAMIC SUBSTRATES FOR USE IN HYBRID CIRCUITS,] [ PRIMARY CELLS, DECADE BOXES, AND ELECTRICAL PHASE SHIFTERS, PHASE MODULATORS, PEAKING NETWORKS, PULSE GENERATORS FOR CONTROLLING THE FLOW OR PHASE RELATIONSHIP OF ELECTRIC POWER, AND ENCLOSURES SHIELDED AGAINST ELECTROMAGNETIC INFLUENCES ];
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

An apparatus for cutting at least one thin layer from a substrate or ingot forming element for an electronic or optoelectronic or optical component or sensor. This apparatus includes a device for directing a pulse of energy into the substrate or forming element wherein the pulse has a duration shorter than or of the same order as that needed by a sound wave to pass through the thickness of the weakened zone, and the energy of the pulse is sufficient to cause cleavage to take place in the weakened zone as the energy of the pulse is absorbed therein. The apparatus also includes an assembly for holding or orienting the substrate or ingot forming element so that the energy pulse is completely uniformly directed over the entire surface, through the face and into the substrate or ingot forming element to cause cleavage to take place in the weakened zone as the energy of the pulse is absorbed therein.