RESIN COATED COPPER FOIL

Brand Owner (click to sort) Address Description
ARCC PANASONIC ELECTRIC WORKS CO., LTD. 1048, OAZA-KADOMA KADOMA-SHI, OSAKA 571-8686 Japan RESIN-COATED COPPER FOIL;
MHCG MITSUI MINING & SMELTING CO., LTD. 1-11-1, Osaki Shinagawa-Ku, Tokyo 0 Japan Resin coated copper foil for printed circuit boards;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. To provide a method of manufacturing a material which can make a skeletal component as thin as possible to be contained in an insulating layer in a manufactured copper clad laminate and can securely prevent the direct contact between the nodular treatment surface of the attached copper foil and a skeletal component. In order to attain the object, here is adopted "a method of manufacturing a copper foil with an insulating layer 1 which method is a method of manufacturing a copper foil provided with a semi-cured insulating resin layer containing a skeletal component on one side surface of the copper foil, and is characterized in that: a first thermosetting resin layer 3 in an uncured or semi-cured state is provided on one side surface of a copper foil 2; a nonwoven fabric 5 or a woven cloth 5 to be a skeletal component is press-bonded onto a first thermosetting resin layer 3; a second thermosetting resin layer 7 is formed on a surface of a press-bonded nonwoven fabric 5 or woven cloth 5; and a semi-cured insulating layer containing the nonwoven fabric 5 or the woven cloth 5 is formed on one side surface of the copper foil 2 by drying into a semi-cured state."