Where the owner name is not linked, that owner no longer owns the brand
Technical Examples
A method for providing cooled flip chip is provided. Solder paste is placed on a back side of a flip chip. A heat sink is placed against the solder paste. The solder paste is reflowed. In addition, an apparatus is provided. Generally, a zener diode flip chip with an active side and a back side opposite the active side and a positive thermal coefficient resistor are provided. A thermally conductive connection is between the positive thermal coefficient resistor and the back side of the zener diode flip chip.