RUBBER SPEED BUMPS ROADS

Brand Owner (click to sort) Address Description
EASY RIDER NOTRAX USA, INC. 5655 WEST 73RD STREET CHICAGO IL 60638 rubber speed bumps for roads;
EASY RIDER 75195459 4000-1155 BOULEVARD RENE-LEVESQUE OUEST MONTREAL, QUEBEC, H3B-3V2 Canada rubber speed bumps for roads;
GLO RIDER GNR TECHNOLOGIES lNC. 990 Upton Street LaSalle, Quebec H8R 2T9 Canada RUBBER SPEED BUMPS FOR ROADS;GLOW RIDER;
TIGAR TIGAR AMERICAS CORPORATION Suit 205 21-25 Center Avenue FORT LEE NJ 07024 Rubber speed bumps for roads;Flexible rubber hoses used for ventilation in the transfer of cooling water and liquids used by internal engines; flexible air hoses with and without dispersion of mineral oils for use in the automotive and construction industries; solid and sponge rubber profiles for use in the construction, automotive, machine, chemical, and textile industries;Footwear, namely, rubbers made of natural rubber and synthetic rubber; rubber footwear, namely, galoshes and boots made of natural rubber and synthetic rubber;TIGER;Commercial administration of the licensing of the goods and services of others; providing business marketing information; business research; goods import-export agencies; procurement, namely, purchasing goods and services for others, all excluding in the field of food and beverages;The English translation of the word TIGAR in the mark is TIGER in Serbian, Croatian and Bosnian Languages.;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The package includes a substrate, a first chip, a second chip, multiple first bumps and multiple second bumps. The substrate has a first region and a second region. The first region is substantially coplanar with the second region. The first bumps connect the first chip and the second chip. The second bumps connect the first chip and the second region of the substrate, wherein the second chip is over the first region of the substrate. The second bumps have a height greater than that of the first bumps plus the second chip. The substrate does not have an opening accommodating the second chip. The first bumps may be gold bumps or solder bumps. The second bumps may be solder bumps.