SCREW CUTTING DIES

Brand Owner (click to sort) Address Description
ACORN GREENFIELD INDUSTRIES, INC. 2501 Davis Creek Road Seneca SC 29678 SCREW-CUTTING DIES;
ACORN GREENFIELD TAP & DIE CORPORATION GREENFIELD MA SCREW-CUTTING DIES;
GTD KENNAMETAL INC. 1600 Technology Way Latrobe PA 15650 Screw-Cutting Dies, Taps,[ Tapping Attachments,] Diestocks, Tap-Wrenches; Scre w-Plates, (Sets of Dies, Taps and Accessories;) Reamers,[ Drilling Machines, ] Metal-Working Drills, Holders for Dies, Mandrels, Pulleys, Counter-Shafts,[ Bolt-Threaders, Cold-Saw Cutting-Off Machines, Tool-Grinders, Lathes, Pipe-Wrenches, Pipe-Cutters; Receders, (Receding Pipe-Threaders; Pipe-Vises, and Pipe-PlateS];
LIGHTNING KENNAMETAL INC. 1600 Technology Way Latrobe PA 15650 Screw-Cutting Dies, [ Taps, Tapping Attachments, Die-Stocks, Tap-Wrenches; Screw-Plates (Sets of Dies, Taps, and Accessories;) Reamers, Drilling-Machines, Metal-Working Drills, Holders for Dies, Mandrels, Pulleys, Counter-Shafts, Bolt-Threaders, Cold-Saw Cutting-Off Machines, Tool-Grinders, Lathes, Pipe-Wrenches, Pipe-Cutters; Receders, (Receding Pipe-Threaders,) Pipe-Vises, and Pipe-Plates];
LITTLE GIANT KENNAMETAL INC. 1600 Technology Way Latrobe PA 15650 Screw-Cutting Dies, [Taps; Tapping Attachments, (Devices for Attachment to Machines for Receiving and Operating Taps;) ]Diestocks, [Tap-Wrenches; ] Screw-Plates, (Sets of Dies, [Taps, ] Wrenches, Stocks, and Collets;) [ Reamers, Drilling Machines, Metal Working Drills, Holders for Dies, Mandrels, Pulleys, Counter-Shafts, Bolt Threaders, Tool-Grinders, Lathes, Pipe-Wrenches, Pipe-Cutters; Receders, (Receding Pipe-Threaders;) Pipe-Vises, and Pipe-Plates];
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A pre-process before cutting a wafer is described. The wafer includes a plurality of scribe lines and a plurality of dies defined by the scribe lines, and a material layer covers the wafer. A pre-processing step is performed to remove the material layer on the scribe lines close to the corner regions of the dies. Removing the material layer at the corner regions before cutting the wafer is able to preserve the integrity of the corner regions of the cut dies.