SELF POLISHING

Brand Owner (click to sort) Address Description
CONVERSATION BALL CHEMICAL COMPANY 1486 BUTLER PLANK ROAD GLENSHAW PA SELF-POLISHING, FLOOR FINISHING PREPARATION;
NEO-SHINE HUNTINGTON LABORATORIES, INC. HUNTINGTON IND SELF-POLISHING, WATER-DISPERSED FLOOR WAX;NEW-SHINE;
VALOR PURITAN/CHURCHILL CHEMICAL COMPANY 916 ASHBY ST. N.W. ATLANTA GA 30318 SELF-POLISHING, WAXLESS FLOOR POLISH;SELF-POLISHING, WAXLESS FLOOR POLISH;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method for chemical mechanical polishing (CMP) wafers having high aspect ratio surface topography. A wafer is positioned on a plate. A polishing pad is coupled to a platen. A polishing solution (e.g., slurry) is added between the polishing pad and the wafer. CMP is performed on the wafer by creating a relative movement between the polishing pad and the wafer. The polishing pad removes substantially all residual material from the channels. To accomplish this, the polishing pad has a compressibility of at least 5% at a polishing pressure of about 4 psi.