SEMICONDUCTOR CHIPS SEMICONDUCTOR CHIP

Brand	Owner (click to sort)	Address	Description
DFD	INVENSAS CORPORATION	3025 Orchard Parkway San Jose CA 95134	SEMICONDUCTOR CHIPS AND SEMICONDUCTOR CHIP PACKAGES;
QFD	INVENSAS CORPORATION	3025 Orchard Parkway San Jose CA 95134	SEMICONDUCTOR CHIPS AND SEMICONDUCTOR CHIP PACKAGES;
TFD	INVENSAS CORPORATION	3025 Orchard Parkway San Jose CA 95134	SEMICONDUCTOR CHIPS AND SEMICONDUCTOR CHIP PACKAGES;
XFD	INVENSAS CORPORATION	3025 Orchard Parkway San Jose CA 95134	SEMICONDUCTOR CHIPS AND SEMICONDUCTOR CHIP PACKAGES;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A method of stacking semiconductor chips includes providing four semiconductor chips that each include a top surface with central bond pads. Each of the bond pads is electrically coupled to second bond pads located in a peripheral portion of the semiconductor chip through a conductive layer. The first and the second semiconductor chips are arranged alongside one another on a carrier substrate. The second bond pads from the first and second semiconductor chips are bonded to corresponding landing pads on the substrate. The third semiconductor chip is then stacked over the first semiconductor chip and the fourth semiconductor chip over the second semiconductor chip. The second bond pads of the third and fourth semiconductor chips can then be bonded to contact pads of the substrate. The substrate can then be separated into a first stack that includes the first and third semiconductor chips and a second stack that includes the second and fourth semiconductor chips.