SEMICONDUCTOR DEVICE MANUFACTURING MACHINES

Brand Owner (click to sort) Address Description
FLEXALIGN BROOKS AUTOMATION, INC. 15 Elizabeth Drive Chelmsford MA 01824 Semiconductor device manufacturing machines; semiconductor wafer processing equipment; semiconductor substrate manufacturing machines; semiconductor wafer processing machines; semiconductor wafer processing machines, namely, wafer alignment machines; semiconductor wafer processing machines, namely, machines for determining the orientation of a semiconductor wafer; semiconductor wafer processing machines, namely, machines for determining the center of a semiconductor wafer; semiconductor wafer processing machines, namely, machines for centering a semiconductor wafer; substrate alignment machines for use in manufacturing automation; machines for manufacturing semiconductor devices; industrial robots, and components thereof, for aligning semiconductor wafers; industrial robots, and components thereof, for determining the orientation of a semiconductor wafer; industrial robots, and components thereof, for determining the center of a semiconductor wafer; industrial robots, and components thereof, for centering a semiconductor wafer;FLEX ALIGN;
INFINITY BROOKS AUTOMATION, INC. 15 Elizabeth Drive Chelmsford MA 01824 Semiconductor device manufacturing machines; semiconductor wafer processing equipment; semiconductor substrate manufacturing machines; semiconductor wafer processing machines; semiconductor wafer processing machines, namely, wafer handling robots and components thereof; machines for manufacturing semiconductor devices; machines for transporting semiconductor wafers for use in manufacturing automation; industrial robots, and components thereof, for transporting semiconductor wafers and semiconductor wafer manufacturing tools in the field of manufacturing automation; industrial robots, and components thereof, for transporting semiconductor wafers and semiconductor wafer manufacturing tools; industrial robots, and components thereof, for transporting wafers and wafer manufacturing tools in the field of semiconductor manufacturing automation; industrial robots, and components thereof, for transporting wafers and wafer manufacturing tools in the field of semiconductor device manufacturing machines; industrial robots, and components thereof, for transporting semiconductor wafers; industrial robots for the tracking, transport, storage, and processing of semiconductor wafers; industrial robots for transporting semiconductor wafers or wafer manufacturing tools from one container to another container or for transporting individual containers from one location to another location; industrial robots featuring capabilities for storing, indexing, and future retrieval of semiconductor wafers or semiconductor wafer tools;
MARATHON BROOKS AUTOMATION, INC. 15 Elizabeth Drive Chelmsford MA 01824 Semiconductor device manufacturing machines; semiconductor wafer processing equipment; semiconductor substrate manufacturing machines; semiconductor wafer processing machines; semiconductor wafer processing equipment, namely, enclosures for containing industrial robots used in transporting semiconductor wafers and devices; semiconductor wafer processing equipment, namely, pressure vessels for containing industrial robots used in transporting semiconductor wafers and devices; semiconductor wafer processing equipment, namely, industrial robots and enclosures used in transporting semiconductor wafers and devices; machines for manufacturing semiconductor devices; machines for transporting semiconductor wafers for use in manufacturing automation; cluster-tool integration platforms used in the manufacture of integrated circuits and semiconductor devices;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. A method of making a semiconductor device manufacturing mask, which makes it possible to suppress a semiconductor-device global step and simply manufacture a highly reliable semiconductor device. Square dummy patterns each having one side of, for example, 0.25 ?m or less are inserted into an area other than an actual pattern lying within a semiconductor device manufacturing mask to thereby uniformize a pattern density, enable etching processing without changing conditions set for every semiconductor device manufacturing mask an prevent an increase in global step of a post-CMP interlayer insulating film.