SEMICONDUCTOR FABRICATION MACHINES

Brand	Owner (click to sort)	Address	Description
IPULSAR PLUS	ADVANCED ION BEAM TECHNOLOGY, INC.	5F, NO.18, CREATION ROAD 1, SCIENCE PARK HSIN-CHU 300 Taiwan	Semiconductor fabrication machines; Ion implanter;I PULSAR PLUS;
MORI	SPP PROCESS TECHNOLOGY SYSTEMS UK LIMITED	C/O SURFACE TECHNOLOGY SYSTEMS PLC, IMPERIAL, PARK, NEWPORT, WALES NP10 8UJ United Kingdom	Semiconductor fabrication machines; machines for fabricating Micro-Electrical-Machine systems (MEMS)comprised of mechanical elements, sensors, actuators and electronics on a common silicon substrate; thin film fabrication machines; plasma generating machines for use in the manufacture of semiconductors [ ; and parts for all the aforesaid goods];
THE PLASMA COMPANY	Plasma & Materials Technologies, Inc.	9255 Deering Avenue Chatsworth CA 91311	semiconductor fabrication machines;THE;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A method for determining photoresist thickness is disclosed that can be used in a semiconductor fabrication process. A layer of material is formed that has one or more common characteristic relative to the material in the layer that is to be patterned in the semiconductor fabrication process. A layer of photoresist is then formed that has varying thickness. The thickness of the layer of photoresist is determined at a plurality of different points. The layer of photoresist is exposed, developed and etched. The remaining structures are then analyzed to determine photoresist thickness to be used in the semiconductor fabrication process. The determined photoresist thickness is then used in the semiconductor fabrication process to form structures on a semiconductor wafer.