SEMICONDUCTOR PARTS

Brand Owner (click to sort) Address Description
AIONIC ArchiTek Corporation 1-1-29, Kitahorie, Nishi-ku Osaka city Osakafu 550-0014 Japan Semiconductor parts, namely, semiconductor chips, semiconductor microprocessors, semiconductor processor chips, large scale integration (LSI) semiconductor integrated circuits, semiconductor integrated circuit chips for processing artificial intelligence (AI) and images and videos, semiconductor devices and microprocessors; electronic circuits; integrated circuits; large scale integrated circuits; downloadable computer programs for processing digital image, Artificial Intelligence (AI) training, detecting Artificial Intelligence (AI), classifying Artificial Intelligence (AI), inferencing Edge Artificial Intelligence (AI), developing computer vision, operating parallel processing, detecting simultaneous localization and mapping applications in the field of autonomous driving, security, and inspection; semiconductors; computer hardware;
ARCHITEK ArchiTek, Inc. 1-1-29 Kitahorie, Nishi-ku Yotsubashi MT Hase Building 2nd floor Osaka 550-0014 Japan Semiconductor parts, namely, semiconductor chips, semiconductor microprocessors, semiconductor processor chips, large scale integration (LSI) semiconductor integrated circuits, semiconductor integrated circuit chips for processing artificial intelligence (AI) and images and videos, semiconductor devices and microprocessors; electronic circuits; integrated circuits; large scale integrated circuits; downloadable computer programs for processing digital image, Artificial Intelligence (AI) training, detecting Artificial Intelligence (AI), classifying Artificial Intelligence (AI), inferencing Edge Artificial Intelligence (AI), developing computer vision, operating parallel processing, detecting simultaneous localization and mapping applications in the field of autonomous driving, security, and inspection; semiconductors; computer hardware;ARCHITECT;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. In a camera module of a so-called multi-chip type, an imaging device and a semiconductor element for processing are mounted. The semiconductor element is encapsulated by a mold resin. Protruding parts are formed by the mold resin on a mounting surface of the mold resin. A metal film forming a pattern wiring is formed on the mounting surface of the mold resin. The metal film is also formed on the protruding parts so as to constitute external connection terminals together with the protruding parts. Electrodes of the semiconductor element are electrically connected to the pattern wiring. The protruding parts include first protruding parts positioned around the semiconductor element and second protruding parts formed in a mounting area of the semiconductor element on the mounting surface.