SEMICONDUCTOR PROCESSING MACHINES ETCHING

Brand Owner Address Description
EI - EXTRUSION INTELLIGENCE COSTRUZIONI MECCANICHE LUIGI BANDERA S.P.A. 120, CORSO SEMPIONE BUSTO ARSIZIO PROVINCE OF VARESE 21052 Italy Semiconductor processing machines for etching semiconductor substrates; semiconductor processing machines for the manufacture of semiconductor substrates; industrial printing machines for printing on product substrates; industrial printing machines; printing rollers for machines; ink jet printing machines; inking apparatus for printing machines; vapor deposition machines, namely, machines for chemical vapor deposition (CVD) for manufacturing semiconductors; machines for processing plastics; machine tools for the extrusion of plastic materials; extrusion moulding machines; plastics injection forming machines; injection plastics moulding machines; electric welding machines for plastics; plastic waste crushing machines; stretch-wrapping machines for applying plastics material to palletized loads; stretch-wrapping machines for applying plastics film to palletized loads; machines for plastics working, namely, plastic coating machines; lamination coating machines for industrial use, not office use; mechanical mixing machines; packaging machines, namely, an electrical apparatus for sealing plastics; grinding machines, namely, regrinding mills for producing plastic pellets; machine parts, namely, forging moulds for moulding plastics products; packaging machines in the nature of a packaging apparatus; vacuum packing machines; packaging tools, namely, machine tools in the nature of rotary dies for cutting boxes for packaging industry; packaging machines; packaging machines for food; machines for manufacturing packaging materials; machines for sealing packaging containers for industrial purposes; industrial printing machines for printing on packaging;Blister packs for packaging; plastic film for packaging; plastic wrap; packaging materials made of plastic, namely, plastic bags for packaging; plastic materials for packaging, namely, adhesive plastic films for packaging; plastic waterproofing film for packaging; plastic film for wrapping; bags made of plastics for packaging;EXTRUSION;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A flat panel display and fabrication method thereof. The present invention uses four etching processes to define a second conducting layer, a doped semiconductor layer and a semiconductor layer. The first etching process is a wet etching using a first resist layer to etch the second conducting layer. The second etching process is executed with an etchant comprising oxygen to etch the doped semiconductor layer and the semiconductor layer, and the first resist layer undergoes ashing during etching so as to become a second resist layer with a channel pattern. The third etching process is another wet etching, and the second conducting layer is etched again using the second resist layer as the etching mask. The fourth etching process is executed to dry etch the doped semiconductor layer using the second resist layer as the etching mask.