SEMICONDUCTOR PROCESSING UNITS ETCHING

Brand	Owner	Address	Description
EQUINOX	Applied Materials Inc.	M/S 1241 3050 Bowers Avenue Santa Clara CA 95054	semiconductor processing units for etching and chemical processing of semiconductor wafers, substrates, and magnetic disks;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A flat panel display and fabrication method thereof. The present invention uses four etching processes to define a second conducting layer, a doped semiconductor layer and a semiconductor layer. The first etching process is a wet etching using a first resist layer to etch the second conducting layer. The second etching process is executed with an etchant comprising oxygen to etch the doped semiconductor layer and the semiconductor layer, and the first resist layer undergoes ashing during etching so as to become a second resist layer with a channel pattern. The third etching process is another wet etching, and the second conducting layer is etched again using the second resist layer as the etching mask. The fourth etching process is executed to dry etch the doped semiconductor layer using the second resist layer as the etching mask.