SEMICONDUCTOR COMPONENT

Brand Owner (click to sort) Address Description
SOFTCELL SOFTPV lnc. #606, 545, Dunchon-daero, Jungwon-gu Seongnam-si 13215 Republic of Korea semiconductor component, namely, electric conductors; solar cells for electricity generation; components for electric circuits, namely, electric conductors and electric current control devices; silicon chips for electronic components; electronic chips for the manufacture of integrated circuits; battery and battery charger; electronic components for computers; solar batteries;SOFT CELL;
SOFTFORM SOFTPV lnc. #606, 545, Dunchon-daero, Jungwon-gu Seongnam-si 13215 Republic of Korea semiconductor component, namely, electric conductors; solar cells for electricity generation; components for electric circuits, namely, electric conductors and electric current control devices; silicon chips for electronic components; electronic chips for the manufacture of integrated circuits; battery and battery charger; electronic components for computers; solar batteries;semiconductor component, namely, electrical insulators;SOFT FORM;
SOFTGOODS SOFTPV lnc. #606, 545, Dunchon-daero, Jungwon-gu Seongnam-si 13215 Republic of Korea semiconductor component, namely, electric conductors; solar cells for electricity generation; components for electric circuits, namely, electric conductors and electric current control devices; silicon chips for electronic components; electronic chips for the manufacture of integrated circuits; battery and battery charger; electronic components for computers; solar batteries;semiconductor component, namely, electrical insulators;SOFT GOODS;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method for manufacturing a semiconductor component, such as, for example, a multilayer semiconductor component including a micromechanical component, such as, for example, a heat transfer sensor having a semiconductor substrate of silicon, and a sensor region. For inexpensive manufacture of a thermal insulation between the semiconductor substrate and the sensor region a porous layer is provided in the semiconductor component.