SEMICONDUCTOR WAFER SUBSTRATE PROCESSING

Brand	Owner	Address	Description
SAPPHIRE	ULTRATECH, INC.	3050 Zanker Road San Jose CA 95134	Semiconductor wafer and substrate processing apparatus in the nature of photolithographic and implanting apparatus for producing images, and printing or implanting images on wafers and other substrates and for the production of semiconductor chips; maintenance software to insure the precision of the positioning of the wafers and substrates and the image transfer and implanting subsystems to insure proper placement if the images thereon; software to control and optimize stepper performance of imaging, printing implanting of material on the wafer or substrate for the production of semiconductor chips; special tooling for transferring the wafers and substrates into and out of the apparatus for the aforesaid goods; and manuals sold as a unit with the aforesaid goods;Color is not claimed as a feature of the mark.;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

In manufacturing thinned semiconductor chips by grinding a semiconductor wafer supported on a rigid support substrate, in order to remove the semiconductor wafer or semiconductor chips from the support substrate without damage to the semiconductor wafer or semiconductor chips, a semiconductor wafer at its surface is bonded on a light-transmissive support substrate through an adhesive layer having an adhesion force that is reduced upon exposure to light radiation, thereby exposing the back surface of the semiconductor wafer. A tape is bonded to the backside of the semiconductor wafer integrated with the support substrate after grinding, wherein the tape is supported at the periphery. Before or after bonding of the tape, light radiation is applied to the adhesive layer at a side close to the support substrate to reduce the adhesion force in the adhesion layer. Thereafter, the support substrate and adhesive layer is removed from the surface of the semiconductor wafer, leaving the semiconductor wafer held by the tape and frame. The semiconductor wafer supported by the tape and frame is cut at streets into individual semiconductor chips.