SEMICONDUCTOR WAFERS

Brand Owner (click to sort) Address Description
3SW300 3S Korea Co., Ltd. 30-1, Siheung-daero 71-gil, Geumcheon-gu Seoul 08614 Republic of Korea Semiconductor wafers; protective carrying cases specially adapted for semiconductor wafers;THREE SEMICONDUCTOR WAFERS THREE HUNDRED;
ACROTEC JX Nippon Mining & Metals Corporation 1-2, Otemachi 1-chome Chiyoda-ku, Tokyo 100-8164 Japan Semiconductor wafers; single crystal substrates, namely, substrates of indium phosphide (InP) or Cadmium telluride (CdTe) in the form of semiconductor wafers or ingots; single crystal substrates, namely, substrates of Cadmium zinc telluride (CdZnTe) in the form of semiconductor wafers or blocks; single crystal substrates, namely, substrates of Zinc telluride (ZnTe) in the form of semiconductor wafers;High purity metals containing Aluminum, Titanium, Chromium, Manganese, Iron, Cobalt, Nickel, Copper, Zinc, Zirconium, Niobium, Silver, Cadmium, Indium, Tin, Antimony, Tellurium, Hafnium, Tantalum or Tungsten in the form of ingots or shots for industrial uses;
ACUTHIN HUGHES AIRCRAFT COMPANY Culver City CA semiconductor wafers;ACU-THIN;
ACUTHIN HUGHES AIRCRAFT COMPANY Culver City CA semiconductor wafers;ACU-THIN;
AQUARIUS Epistar Corporation Science-based Industrial Park No. 5, Li Hsin 5th Road Hsinchu Taiwan Semiconductor wafers, semiconductor chips, silicon wafers, silicon chips and computer chips;
ASTRALFORGE Frick, Jessica Jane 630 Homer Ave Unit C Palo Alto CA 94301 Semiconductor wafers; Semiconductors;
BANDGAP BANDGAP TECHNOLOGY CORPORATION 891A Interlocken Parkway Broomfield CO 80020 semiconductor wafers;Band Gap;volatile metal compounds for use in the production of semiconductors and semiconductor devices;
CLESTA Z SUMCO CORPORATION 1-2-1 Shibaura, Minato-ku Tokyo 105-8634 Japan Semiconductor wafers;
CLESTA Z SUMCO CORPORATION 1-2-1 Shibaura, Minato-ku Tokyo 105-8634 Japan Semiconductor wafers;
CLESTA Z SUMCO CORPORATION 1-2-1 Shibaura, Minato-ku Tokyo 105-8634 Japan Semiconductor wafers;
EPIGAN Soitec Belgium NV Kempische steenweg 293 B-3500 Hasselt Belgium Semiconductor wafers; semiconductor devices; semiconductor power elements;
EPIGAN EpiGaN nv Kempische steenweg 293 B-3500 Hasselt Belgium Semiconductor wafers; semiconductor devices; semiconductor power elements;
EPISTAR Epistar Corporation Science-based Industrial Park No. 5, Li Hsin 5th Road Hsinchu Taiwan Semiconductor wafers, semiconductor chips, silicon wafers, silicon chips and computer chips;Color is not claimed as a feature of the mark.;
EPISTAR CORPORATION Epistar Corporation Science-based Industrial Park No. 5, Li Hsin 5th Road Hsinchu Taiwan Semiconductor wafers, semiconductor chips, silicon wafers, silicon chips and computer chips;Color is not claimed as a feature of the mark.;CORPORATION;
INTELLIGENT FACTORY YAMAHA HATSUDOKI KABUSHIKI KAISHA 2500 Shingai, Iwata-shi Shizuoka-ken 438-8501 Japan Semiconductor wafers; semiconductor chip sets; probes for testing semiconductors; semiconductor testing apparatus; computer software for use in processing semiconductor wafers; optical inspection apparatus for inspection of semiconductor materials, namely, semiconductor wafers and reticles; scientific apparatus, namely, sensing and signaling devices for measurement and quality control of materials processing; electronic monitors to collect operational data and settings from semiconductor equipment to ensure proper functioning; wireless controllers to remotely monitor and control the function and status of other electrical, electronic and mechanical devices or systems, namely, semiconductor manufacturing systems; computer hardware and software systems for remotely monitoring semiconductor manufacturing systems; downloadable computer software for productivity improvement in the field of manufacturing;Semiconductor manufacturing machines; semiconductor wafer processing equipment; semiconductor manufacturing robots; semiconductor wafer processing robots; machines for mounting electronic components to circuit boards; machines for automatically conveying electronic components; electronic circuit assembling robots; adhesive-applying machines for adhering electronic components to circuit boards; soldering machines for electronic circuit boards; electronic component manufacturing machines; electronic component manufacturing robots; pick and place machines; semiconductor processing machines; industrial robots; surface mounting machines for mounting electronic components onto printed circuit boards; power-operated dispensing machines for applying adhesive to printed circuit boards; automatic solder-paste printing machines for printing solder paste on printed circuit boards; printed circuit board inspection machines;FACTORY;
KOPIN KOPIN CORPORATION 125 North Drive Westborough MA 01581 SEMICONDUCTOR WAFERS;COPING;
MAGIC VOICE Holtek Microelectronics Inc. PARK, HSIN CHU Taiwan semiconductor wafers; semiconductor chips; semiconductors; integrated circuits; semiconductor devices; electronic circuit boards; computer interface cards;VOICE;
OMA Epistar Corporation Science-based Industrial Park No. 5, Li Hsin 5th Road Hsinchu Taiwan Semiconductor wafers, semiconductor chips, silicon wafers, silicon chips and computer chips;
OTC Osaka Titanium Co., Ltd. 1 Higashihama-cho Amagasaki, Hyogo Japan semiconductor wafers;titanium sponges for use with titanium ingot and titanium powder as used in industries such as the aircraft industry;OTC;semiconductor silicon crystals;The lining shown in the mark constitutes a feature thereof and is not intended to indicate a specific color.;
PARAGON AT&T CORP. 32 Avenue of the Americas New York NY 10013 semiconductor wafers;
QWT QROMIS, INC. 2306 WALSH AVENUE SANTA CLARA CA 95051 semiconductor wafers;
SAPHLUX Saphlux, Inc. 4 Pin Oak Drive Branford Branford CT 06405 Semiconductor wafers;
SATURN Epistar Corporation Science-based Industrial Park No. 5, Li Hsin 5th Road Hsinchu Taiwan semiconductor wafers, semiconductor chips, silicon wafers, silicon chips and computer chips;
SPEAR HUGHES AIRCRAFT COMPANY Culver City CA SEMICONDUCTOR WAFERS;
SUMCO SUMCO CORP. 1-2-1 SHIBAURA , MINATO-KU TOKYO 105-8634 Japan SEMICONDUCTOR WAFERS;Color is a feature of the mark. The letters S, M, C, and O are dark blue, and the letter U is light blue.;SUMITOMO CORPORATION;Color is not claimed as a feature of the mark.;
SUMCO GROUP SUMITOMO MITSUBISHI SILICON CORPORATION 1-2-1 Shibaura, Minato-ku Tokyo 105-8634 Japan SEMICONDUCTOR WAFERS;
SUMCO USA SUMITOMO MITSUBISHI SILICON CORPORATION 1-2-1 Shibaura, Minato-ku Tokyo 105-8634 Japan SEMICONDUCTOR WAFERS;SUMITOMO CORPORATION UNITED STATES AMERICA;
SUNEDISON SEMICONDUCTOR GLOBALWAFERS CO., LTD. NO. 8, INDUSTRIAL ROAD 2, SCIENCE-BASED INDUSTRIAL PARK HSINCHU Taiwan Semiconductor wafers; silicon wafers;SEMICONDUCTOR;
TAT Etron Technology, Inc. No. 6, Technology Road 5 Hsinchu 30078 Taiwan Semiconductor wafers; Semiconductor chips; Integrated circuits; Integrated circuit modules; Dynamic random access memory (DRAM); Static random access memory (SRAM);Design and testing of semiconductors and integrated circuits for others; Design and testing of semiconductor chips and devices for others; Semiconductor integrated circuit design and consultation; Integrated circuit design consultation; Technical consultation in the fields of integrated circuit design;
UNITRANS TAM CERAMICS, INC. BOX C, BRIDGE STATION NIAGARA FALLS NY 14305 SEMICONDUCTOR WAFERS;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method and structure for fabricating semiconductor wafers. The method comprises providing a plurality of semiconductor wafers. The plurality of semiconductor wafers comprises a first semiconductor wafer and a second semiconductor wafer. The first semiconductor wafer is located adjacent to the second semiconductor wafer. A relationship is provided between a plurality of values for an electrical characteristic and a plurality of materials. A material is chosen from the plurality of materials existing in the relationship. A substructure is formed comprising the material sandwiched between a topside of the first semiconductor wafer and a backside of a portion of the of the second semiconductor wafer. The plurality of semiconductor wafers are placed into a furnace comprising an elevated temperature for processing resulting in a value for the first semiconductor wafer of the electrical characteristic that corresponds to said material in said relationship.