SHEET LAYER CAKES PACKAGED

Brand	Owner	Address	Description
JUNIORS	Tastykake, Inc.	2801 Hunting Park Ave. Philadelphia PA 19129	SHEET AND LAYER CAKES PACKAGED AS INDIVIDUAL SERVINGS;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A method of packaging an integrated circuit die (12) includes the steps of providing a foil sheet (30) and forming a layer of solder (32) on a first side of the foil sheet. A first side of the integrated circuit die is attached to the solder on the foil sheet. The first side of the die has a layer of metal (34) on it and a second, opposing side of the die includes bonding pads (14). The bonding pads are electrically connected to the solder on the foil sheet with wires (16). The die, the electrical connections, and the first side of the foil sheet are encapsulated with a mold compound (20). The foil sheet is separated from the die and the wires, which forms a packaged integrated circuit (10).