SINGLE FLIPCHIP BALL GRID ARRAY

Brand Owner Address Description
FLIPCHIP Litronic, Inc. 17861 CARTWRIGHT ROAD IRVINE CA 92614 single flipchip ball grid array - integrated circuit package multi flipchip ball grid array - integrated circuit package flipchip multichip electronic module assemblies flipchip density patches for printed circuit boards;FLIP CHIP;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method of fabricating a microelectronic multi-chip module comprises: providing a cavity down ball grid array having a die and solder balls on a die side thereof; providing a package including at least one die thereon on a die side thereof; stacking the package onto the backside of the ball grid array opposite from the die side of the ball grid array. The backsides of the ball grid array and of the package may include land pads for providing interconnection between the ball grid array and the package during stacking.