SITE WIRE

Brand Owner (click to sort) Address Description
SITEWIRE SITEWIRE MARKETSPACE SOLUTIONS 740 South Mill Avenue, Suite 210 Tempe AZ 85281 SITE WIRE;Marketing services for others, namely, marketing content development, customer journey mapping, media placement, strategy and management, social media strategy consultation, and social media community management;Website development for others for marketing purposes; optimization of online websites for third parties for marketing purposes; mobile application computer software development for marketing purposes;
SITEWIRE ByldTech, Inc. 701 Glenside Drive Lafayette CA 94549 SITE WIRE;Software as a service (SAAS) services featuring software for real estate loan disbursement and construction progress monitoring;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The present invention is a method and apparatus for forming a bump for semiconductor interconnect applications, such as reverse wire bonding or stud bumping for flip chip interconnections. The bump is formed by (1) ball bonding at the bump site, (2) raising the capillary a predetermined height after forming the ball bond with the wire paying out of the capillary tip, (3) moving the capillary laterally a predetermined distance, preferably in a direction toward the site of other end of the wire loop, if the bump is to be used as the platform for a stitch bond of a wire loop, (4) raising the capillary further, and (5) moving the capillary diagonally downwardly and in the opposite direction of the first lateral motion. The wire is then severed by raising the capillary, closing the clamps and raising the capillary again to snap the wire pigtail off at the bump.