SOLDER ALLOYS

Brand Owner (click to sort) Address Description
KAPP ALLOY KAPP ALLOY & WIRE, INC. 1 Klein Street Oil City PA 16301 Solder alloys;
SN100CV Nihon Superior Co., Ltd. 16-15, Esakacho 1-chome, Suita-shi Osaka 564-0063 Japan Solder alloys; solder pastes; solders in the form of powder, ribbon, ball, wire or bar; flux-cored solder;SN ONE HUNDRED CV;
SOLDER COAT CO.,LTD. SOLDER COAT CO., LTD. 75-1 Choda Japan Solder alloys; solder bars; solder wires; flux cored solders; solder balls; nonferrous metals and their alloys, other than solder alloys; solder pastes;Color is not claimed as a feature of the mark.;Soldering fluxes;
SOLDER TEAM SN100C V RANGERS Nihon Superior Co., Ltd. 16-15, Esakacho 1-chome, Suita-shi Osaka 564-0063 Japan Solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; brazing alloys; flux-cored solder; non-ferrous metals and their alloys;The color(s) red, blue, green, pink, yellow, dark orange, light orange and black is/are claimed as a feature of the mark.;Demonstration of goods; distribution and dissemination of advertising materials; on-line advertising on computer networks; distribution of samples; organization of trade fairs for commercial or advertising purposes; organization of exhibitions for commercial or advertising purposes; marketing services; presentation of goods on communication media, for retail purposes; providing information concerning commercial sales; commercial information and advice for consumers; retail services or wholesale services for printed matter; retail services or wholesale services for paper and stationery;Soldering fluxes; soldering paste; soldering preparations; soldering chemicals; brazing fluxes; brazing preparations; brazing chemicals; industrial chemicals; chemicals; detergents for industrial use; detergent for use in manufacturing processes;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A device with a solder joint made of a copper contact pad (210) of certain area (202) and an alloy layer (301) metallurgically attached to the copper pad across the pad area. The alloy layer contains copper/tin alloys, which include Cu6Sn5 intermetallic compound, and nickel/copper/tin alloys, which include (Ni,Cu)6Sn5 intermetallic compound. A solder element (308) including tin is metallurgically attached to the alloy layer across the pad area. No fraction of the original thin nickel layer is left after the reflow process. Copper/tin alloys help to improve the drop test performance, nickel/copper/tin alloys help to improve the life test performance.