SOLDERLESS TERMINAL KIT COMPRISED

Brand Owner Address Description
VOLTREX PREMIER FARNELL CORP. 300 South Riverside Plaza, Suite 2200 Chicago IL 60606 solderless terminal kit comprised of solderless terminals in the nature of electric conductors; audio cables; cable connectors; electrical connectors; threaded cable connectors of metal; flexible split-loom tubing for covering wires and cables; electrical wire and cable organizers, namely, wiring ducts and wiring covers; electric audio plugs; electrical audio jack connectors; electrical banana plug connectors; electrical banana jack connectors; electrical binding post connectors; electric plug and pin plugs; jack boards; electric jack connectors; electrical BNC connectors, electrical TNC connectors, electrical UHF connectors; audio adapters; electrical components, namely, DIN connectors; dual binding post connectors; test jack connectors; electric crimp-style stamped contacts; coaxial adapters; gender changers, namely, cable adapters; electric dip sockets; chip carriers, namely, semiconductor chip housings; snap on spade terminal conductors; electrical terminals in the nature of electrical connectors, namely, ring tongue terminals, butt splice terminals, and quick disconnect terminals;Connector and cable installation hand tools, namely, crimping tools in the nature of wire crimpers for connecting cables;Heat shrink tubing for covering electrical wire and nylon grommets; electrical wraps and sleeves for protecting and insulating electrical wires and terminals; insulating tubing;Electrical wire and cable organizers, namely, cable ties and wire ties; cable ties and straps for fastening and securing objects such as bundles of wire together;Non-metal cable clips;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. To decrease the thickness, or stack height, of an electronics package, the package includes a solderless compression connector between an integrated circuit (IC) package and a substrate such as a printed circuit board (PCB). In one embodiment, the IC package is mounted on the substrate using a land grid array arrangement. Corresponding lands on the IC package and substrate are coupled using a solderless compression connector. The compression connector includes a plurality of electrically conductive particles, and a thin, flexible apertured support that aligns the particles with corresponding lands on the IC package and substrate. A compression connector may also be used to electrically couple an IC to an IC package substrate. Methods of fabrication, as well as application of the package to an electronic assembly, an electronic system, and a data processing system, are also described.