SOLDERLESS

Brand Owner (click to sort) Address Description
CIRCUIT-STRIP AP PRODUCTS INCORPORATED 9450 PINENEEDLE DR. P. O. BOX 603 MENTOR OH 44060 SOLDERLESS, PLUG-IN ELECTRICAL BREADBOARD UNITS;
DISTRIBUTION STRIP AP PRODUCTS INCORPORATED 9450 PINENEEDLE DR. P. O. BOX 603 MENTOR OH 44060 SOLDERLESS, PLUG-IN ELECTRICAL BREADBOARDING BUILDING BLOCKS;
KRONE-LSA-PLUS-CONTACTS ADC GMBH Beeskowdamm 3-11 Berlin 14167 Germany SOLDERLESS, NON-SCREWED AND STRIPPING-FREE ELECTRICAL CONTACTS WITH A POLYTROPIC AIR GAP FOR CABLE TERMINATION DEVICES AND MAIN DISTRIBUTING FRAMES;THE WORD KRONE CAN BE TRANSLATED INTO ENGLISH AS CROWN, CREST OR TOP.;
KRONE-LSA-PLUS-KONTAKTE KRONE AKTIENGESELLSCHAFT Beeskowdamm 3-11 D-14167 Berlin-Zehlendorf Germany Solderless, Screwless and Strippingless Electrical Contacts with a Polytropic Airgap for Cable End Systems and Main Distribution Devices;Krone is the German word translated into English as crown, crest or top. Kontakte is the German word which translates into English as contacts.;
SUPER-STRIP Minnesota Mining and Manufacturing Company St. Paul MN Solderless, Plug-In Electrical Breadboard Units;
TERMINAL STRIP AP PRODUCTS INCORPORATED 9450 PINENEEDLE DR. P. O. BOX 603 MENTOR OH 44060 SOLDERLESS, PLUG-IN ELECTRICAL BREADBOARDING BUILDING BLOCKS;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. To decrease the thickness, or stack height, of an electronics package, the package includes a solderless compression connector between an integrated circuit (IC) package and a substrate such as a printed circuit board (PCB). In one embodiment, the IC package is mounted on the substrate using a land grid array arrangement. Corresponding lands on the IC package and substrate are coupled using a solderless compression connector. The compression connector includes a plurality of electrically conductive particles, and a thin, flexible apertured support that aligns the particles with corresponding lands on the IC package and substrate. A compression connector may also be used to electrically couple an IC to an IC package substrate. Methods of fabrication, as well as application of the package to an electronic assembly, an electronic system, and a data processing system, are also described.