SUBSTRATA PACKAGE INTEGRATED CIRCUIT

Brand	Owner	Address	Description
ULTRA BGA	TOUCH FUTURE TECHNOLOGY LTD.	18/F, ONE INTERNATIONAL FINANCE CNTR 1 HARBOUR STREET HONG KONG Hong Kong	substrata package for integrated circuit;BGA;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

An integrated circuit package is processed by electroplating the integrated circuit package. The electroplating is performed without forming plating traces on a conductive surface of a pad side of the integrated circuit package. Pad areas of the integrated circuit package are thus plated with one or more materials. An integrated circuit may be electrically coupled to pad areas on the integrated circuit package. The integrated circuit package can be electroplated by using the one or more current sources coupled to a back plane of the integrated circuit package. The back plane is patterned, wherein the patterning of the back plane occurs after the step of electroplating.