SURFACE POLISHING MACHINES SEMICONDUCTOR

Brand Owner Address Description
CMP DRY-IN DRY-OUT EBARA CORPORATION 11-1, Haneda Asahi-cho, Ota-ku Tokyo 144-8510 Japan Surface polishing machines for semiconductor wafers;CMP DRY IN DRY OUT;The mark claims two shades of the color blue as well as the color orange.;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the polishing surface, which is a surface of a polishing cloth.