SYNTHETIC POLYIMIDE RESIN USE

Brand	Owner	Address	Description
KERIMID	JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT	270 PARK AVENUE NEW YORK NY 10017	synthetic polyimide resin for use in the manufacture of printed wiring boards;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A laminate having a metal foil layer, and a polyimide resin layer provided on the metal foil layer, wherein the polyimide resin layer is obtained by curing a coating of a polyimide resin precursor solution directly applied onto a surface of the metal foil layer, wherein the polyimide resin layer has a linear expansion coefficient in the range from 10 to 30 ppm/K, wherein the metal foil layer and the polyimide resin layer have a bonding strength therebetween of at least 0.5 kN/m in terms of 180Â° peel strength, and wherein the polyimide resin obtained from the polyimide resin precursor solution contains at least 50% by weight of a moiety having a structure represented by the following formula (1) shown in the specification.