TESTING APPARATUSES APPLYING MECHANICAL

Brand Owner (click to sort) Address Description
DURAGLIDE MTS Systems Corporation 14000 Technology Drive Eden Prairie MN 55344 Testing apparatuses for applying mechanical loads and displacements to determine mechanical properties of materials, components and structures, and parts therefor, namely, actuators;DURA GLIDE;
FLEXFORCE MTS Systems Corporation 14000 Technology Drive Eden Prairie MN 55344 Testing apparatuses for applying mechanical loads and displacements to determine mechanical properties of materials, components and structures, and parts therefor, namely, actuators;FLEX FORCE;
MTS DURAGLIDE MTS Systems Corporation 14000 Technology Drive Eden Prairie MN 55344 Testing apparatuses for applying mechanical loads and displacements to determine mechanical properties of materials, components and structures, and parts therefor, namely, actuators;MTS DURA GLIDE;
MTS FLEXFORCE MTS Systems Corporation 14000 Technology Drive Eden Prairie MN 55344 Testing apparatuses for applying mechanical loads and displacements to determine mechanical properties of materials, components and structures, and parts therefor, namely, actuators;MTS FLEX FORCE;
MTS SURECOAT MTS Systems Corporation 14000 Technology Drive Eden Prairie MN 55344 Testing apparatuses for applying mechanical loads and displacements to determine mechanical properties of materials, components and structures, and parts therefor, namely, actuators;MTS SURE COAT;
SURECOAT MTS Systems Corporation 14000 Technology Drive Eden Prairie MN 55344 Testing apparatuses for applying mechanical loads and displacements to determine mechanical properties of materials, components and structures, and parts therefor, namely, actuators;SURE COAT;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Setting a polishing rate and a polishing time in chemical mechanical polishing can be performed with high accuracy by considering a product wafer of an object to be polished, and an instrumental error between apparatuses to be used, etc. By using, as a calculating formula, a formula well approximating a portion of a curve representing a state of chemical mechanical polishing on a side showing a target polishing amount, the polishing rate and the polishing time can be set with high accuracy according to a state of chemical mechanical polishing for actually polishing a product wafer. In the calculating formula, a parameter "A" relating to a film property of a film of an object to be polished, a parameter "B" relating to a roughness state of a film surface, and a parameter "C" relating to an instrumental error differential between apparatuses of a chemical mechanical polishing apparatus are joined by operators.