THERMAL BLOCK

Brand Owner (click to sort) Address Description
THERMAL BLOK BUDGE INDUSTRIES 1690 Sumneytown Pike Suite 250 Lansdale PA 19446 THERMAL BLOCK;Fabric sold as an integral component of fitted and semi-fitted covers for electric grill, gas grills, and charcoal grills;THERMAL;
THERMALBLOCK Endemaj IP, Inc. 21011 Hegar Rd. Hockley TX 77447 THERMAL BLOCK;Coating compositions; Coating formulations; Coatings for industrial applications; Coatings compositions for use in HVAC; Coating formulations for use in HVAC; Coatings; Exterior coatings in the nature of paints, primers, sealers for pipes, ductwork; Coatings for metal substrates; Coatings in the nature of paints, primers, sealers, insulating and non-insulating; Insulating and non-insulating coatings for pipes, ductwork, and metal substrates; Exterior surface protective coatings; Coatings for use on roofs and walls; Coatings in the nature of stains for interior and exterior use on a variety of substrates; Heat-resistant coatings for industrial applications where elevated temperatures occur; Coatings, namely, stains and clear finishes for exterior and interior use on a variety of substrates Solar thermal barrier coatings; Thermal barrier coatings; Architectural protective coatings; Floor coatings; Floor topcoats; Antimicrobial coatings;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. The present invention provides a heat sink device for the package device to improve the heat dissipating efficiency. The heat sink device includes a first heat sink assembly and a second heat sink assembly. The first heat sink assembly has a first heat dissipating structure, a second heat dissipating structure positioned above first the heat dissipating structure, at least two thermal supports on the backside of the first heat sink assembly and a thermal block on the backside of the first heat sink assembly. The second heat sink assembly has a protruding structure and at least the openings. The first heat sink assembly is fixed with the second heat sink assembly to form a heat sink device by the combination of the thermal supports and the openings. The first heat sink assembly and the second heat sink assembly are attached to the integrated circuit device separately by the thermal block and the protruding structure. This heat sink device provides several heat dissipating pathes by the second heat dissipating structure, the thermal supports, the thermal block, and protruding structure. Therefore, the heat dissipation efficiency of the heat sink device is improved.