THERMAL INTERFACE MATERIALS

Brand Owner (click to sort) Address Description
CU-THERM LOCKHEED MARTIN CORPORATION 6801 Rockledge Drive Bethesda MD 20817 Thermal interface materials, namely, nanocopper oligomeric adhesive binders and conductive fillers for thermal management, thermal grounding, transferring and removing heat, connecting electronic materials to thermal ground planes, power supplies, power control and switching, computer applications, graphics processing units, lighting systems, electric switches, power control modules;
CU-THERM Kuprion, Inc. 4425 Fortran Dr. San Jose CA 95134 Thermal interface materials, namely, nanocopper oligomeric adhesive binders and conductive fillers for thermal management, thermal grounding, transferring and removing heat, connecting electronic materials to thermal ground planes, power supplies, power control and switching, computer applications, graphics processing units, lighting systems, electric switches, power control modules;
NZIPRR Molecular Nanosystems, Inc. 977 Commercial Street Palo Alto CA 94303 thermal interface materials; thermal pads; carbon nanotubes; carbon nanotubes adapted for use in heat dissipation; materials comprised in whole or in part of carbon nanotubes;
SARCON FUJI POLYMER INDUSTRIES CO., LTD. FUJIPOLY Bldg., 21-1, Meieki 5-chome Nakamura-ku Nagoya-shi, Aichi 450-0002 Japan Thermal interface materials, namely, rubber materials in the nature of thermally conductive synthetic rubber for industrial and commercial use; thermal interface materials, namely, silicone rubber tubes, tapes, cases, gaskets, extrusions and adhesive coatings; thermal interface materials, namely, gap filler pads in the nature of thermally-conductive synthetic rubber for industrial and commercial use; thermal interface materials, namely, compressible gap filler pads in the nature of thermally conductive silicone gap fillers for industrial and commercial use; thermal interface materials, namely, form-in-place gap fillers in the nature of thermally conductive silicone gap fillers for industrial and commercial use; thermal interface materials, namely, non-silicone gap filler pads in the nature of thermally conductive synthetic rubber gap fillers for industrial and commercial use; thermal interface materials, namely, electromagnetic wave absorption padding materials of rubber or plastic; thermal interface materials, namely, thermally conductive silicone non-permanent adhesive putty; thermal interface materials, namely, two-part thermally conductive silicone rubber;
SPHOURIER Shin-Etsu Polymer Co., Ltd. Chiyoda-ku 1-9 Kanda-Sudacho Tokyo 101-0041 Japan Thermal Interface materials, namely, non-metal sheets for radiation of heat from a heat generating component part;
SUR-FLEX Sur-Seal 6156 Wesselman Rd. Cincinnati OH 45248 Thermal interface materials, namely, silicon and foam material for use in insulation and sealing applications;SURE FLEX;
THERMFLOW PARKER INTANGIBLES 6035 PARKLAND BLVD. Cleveland OH 441244141 Thermal interface materials, namely, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thermal dissipation members;THERMAL FLOW;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A thermally conductive member is placed adjacent a microelectronic die with a thermal interface material between the microelectronic die and a wetting layer formed on a surface of the thermally conductive member. The thermal interface material is heated to cause reflow thereof. The first portion of the thermal interface material is directed by the wetting layer into a first cavity formed in the thermally conductive member. The thermal interface material is then allowed to cool and solidify.