THERMOPLASTIC POLYMERIC MATERIALS SOLD

Brand Owner (click to sort) Address Description
ARLON 3000XT GREENE, TWEED TECHNOLOGIES, INC. Suite 1300 1105 North Market Street Wilmington DE 19801 Thermoplastic and polymeric materials sold in rod, pellet, tube, and disc forms, injection-molded and custom machined shaped forms, and other stock shapes, all the foregoing for use by third party manufacturers; thermoplastic compounds, thermoplastic elastomer resins and thermoplastic concentrates sold in rod, pellet, tube, and disc forms, injection-molded and custom machined shaped forms, and other stock shapes, all the foregoing for use in further manufacture; thermoplastic compounds, thermoplastic elastomer resins and thermoplastic concentrates sold in rod, pellet, tube, and disc forms, injection-molded and custom machined shaped forms, and other stock shapes, all the foregoing for use in manufacturing in a wide variety of industries;ARLON THREE THOUSAND XT;
NANOMER DSM IP ASSETS B.V. Het Overloon 1 Heerlen 6411TE Netherlands Thermoplastic and polymeric materials sold in sheet form, rods, pellets, blocks and other stock shapes for medical and pharmaceutical use;
NANOMER The Polymer Technology Group 2810 7th Street Berkeley CA 94710 Thermoplastic and polymeric materials sold in sheet form, rods, pellets, blocks and other stock shapes for medical and pharmaceutical use;
SME DSM IP ASSETS B.V. Het Overloon 1 Heerlen 6411TE Netherlands thermoplastic and polymeric materials sold in sheet form, rods, pellets, blocks and other stock shapes for medical and pharmaceutical use;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. Method and structure for optimizing dual damascene patterning with polymeric dielectric materials are disclosed. Certain embodiments of the invention comprise polymeric sacrificial light absorbing materials ("polymer SLAM") functionalized to have a controllable solubility switch wherein such polymeric materials have substantially the same etch rate as conventionally utilized polymeric dielectric materials, and subsequent to chemical modification of solubility-modifying protecting groups comprising the SLAM materials by thermal treatment or in-situ generation of an acid, such SLAM materials become soluble in weak bases, such as those conventionally utilized to remove materials in lithography treatments.