UPPER RIGHT RECTANGLE INSIDE

Brand Owner (click to sort) Address Description
AMERICAN CASE COMPANY SHAR PRODUCTS COMPANY 2465 S. Industrial Highway Ann Arbor MI 48104 The upper right rectangle inside the large rectangle is red, and the rectangle beneath it is white with a red outline; the remainder of the mark is blue.;[ Cases, in particular valises, travelling trunks, attaché cases, briefcases, vanity cases sold empty, suitcases, travelling bags, beach bags, hunters' game bags, rucksacks, billfolds, credit and business card cases, key cases, garment bags for travel, shoulder bags, handbags, salespersons' sample cases, clutch bags for ladies, purses, waist bags, haversacks, bags for sports, shoe cases for travel, luggage straps, luggage bags ];Cases, sheaths and boxes for musical instruments;The color(s) blue, white and red is/are claimed as a feature of the mark.;[ Weaponry cases, ammunition belts, weapon sheaths, rifle slings; ammunition cases ];AMERICAN CASE COMPANY;
AMERICAN CASE COMPANY Jakob Winter GmbH Graslitzerstrasse 10 64569 Nauheim Germany The upper right rectangle inside the large rectangle is red, and the rectangle beneath it is white with a red outline; the remainder of the mark is blue.;[ Cases, in particular valises, travelling trunks, attaché cases, briefcases, vanity cases sold empty, suitcases, travelling bags, beach bags, hunters' game bags, rucksacks, billfolds, credit and business card cases, key cases, garment bags for travel, shoulder bags, handbags, salespersons' sample cases, clutch bags for ladies, purses, waist bags, haversacks, bags for sports, shoe cases for travel, luggage straps, luggage bags ];Cases, sheaths and boxes for musical instruments;The color(s) blue, white and red is/are claimed as a feature of the mark.;[ Weaponry cases, ammunition belts, weapon sheaths, rifle slings; ammunition cases ];AMERICAN CASE COMPANY;
 

Where the owner name is not linked, that owner no longer owns the brand

   
Technical Examples
  1. A semiconductor memory device formed on a semiconductor chip comprises a plurality of first memory arrays, a plurality of second memory arrays, a first voltage generator, and a plurality of first bonding pads. The semiconductor chip is divided into a first rectangle region, a second rectangle region, and a third rectangle region and the third rectangle region is arranged between the first rectangle region and the second rectangle region. The plurality of first memory arrays are formed in the first rectangle region. The plurality of second memory arrays are formed in the second rectangle region. The voltage generator and the plurality of first bonding pads are arranged in the third rectangle region. The plurality of first bonding pads are arranged between the first rectangle region and the voltage generator and no bonding pads are arranged between the voltage generator and the plurality of second memory arrays.