VAPOR DEPOSITION SUBSTRATE

Brand	Owner	Address	Description
BARRION	IHI IONBOND AG	c/o Dinsmore & Shohl LLP 900 Wilshire Drive Suite 300 Troy MI 48084	Vapor deposition of a substrate layer using metallic and ceramic components to third-party order and specification (surface finishing);
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

In one embodiment, a method for forming a tungsten material on a substrate surface is provide which includes positioning a substrate within a deposition chamber, heating the substrate to a deposition temperature, and exposing the substrate sequentially to a first reducing gas and a tungsten precursor gas to form a tungsten nucleation layer on the substrate during an atomic layer deposition (ALD) process. The method may further provide exposing the substrate to a deposition gas comprising a second reducing gas and the tungsten precursor gas to form a tungsten bulk layer on the tungsten nucleation layer during a chemical vapor deposition (CVD) process. Examples include that the ALD and CVD processes are conducted in the same deposition chamber or in different deposition chambers.