VOLLEY BALLS

Brand Owner (click to sort) Address Description
BEACH BUM Seneca Sports, Inc. Fortune Blvd., Granite Park P. O. Box 719 Milford MA 01757 volley balls;The matter shown by the broken lining is a representation of the goods, not a feature of the mark, no claim is made to it and it serves only to show the position of the mark on the goods.;
K. TACHIKARA TACHIKARA CO., LTD. NO. 4-14, 3-CHOME, NIHONBASHI CHUO-KU, TOKYO Japan VOLLEY BALLS, BASKETBALLS, FOOTBALLS, SOCCER BALLS AND OTHER BALLS FOR SPORTS;SOCCER SHOES, GOLF SHOES AND OTHER SPORT SHOES;
K.TACHIKARA TACHIKARA CO., LTD. NO. 4-14, 3-CHOME, NIHONBASHI CHUO-KU, TOKYO Japan VOLLEY BALLS, BASKETBALLS, FOOTBALLS, SOCCER BALLS AND OTHER BALLS FOR SPORTS;SOCCER SHOES, GOLF SHOES AND OTHER SPORT SHOES;
MUNICH AUDERO SPORTS SUPPLY, INC. 4935 MCCONNELL AVENUE SUITE 11 LOS ANGELES CA 90066 VOLLEY BALLS, SOCCER BALLS, AND THE LIKE;
NEON BRITE FRANKLIN SPORTS, INC. 17 Campanelli Parkway Stoughton MA 02072 volley balls, footballs, soccer balls, basketballs [, lacrosse balls and sticks, dartboards and knee and elbow pads for athletic use ];neon bright;
OLYMPUS CONTINENTAL SPORTS SUPPLY, INC. 3981 S. Decatur St. Englewood CO 80110 VOLLEY BALLS, SOCCER BALLS, AND THE LIKE;
OLYMPUS AUDERO SPORTS SUPPLY INC. 4935 MCCONNELL AVE. LOS ANGELES CA 90066 VOLLEY BALLS, SOCCER BALLS, AND THE LIKE;
ROMA AUDERO SPORTS SUPPLY, INC. 4935 MCCONNELL AVENUE SUITE 11 LOS ANGELES CA 90066 VOLLEY BALLS, SOCCER BALLS, AND THE LIKE;
TACHIKARA TACHIKARA U.S.A., INC. 100 Ireland Drive McCarran NV 89434 VOLLEY BALLS, BASKETBALLS, FOOTBALLS, SOCCER BALLS AND OTHER BALLS FOR SPORTS;[ SOCCER SHOES, GOLF SHOES AND SPORT SHOE ];
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method of packaging an integrated circuit die includes the steps of loading an array of soft conductive balls into recesses formed in a platen and locating the platen in a first part of a mold cavity. A second part of the mold is pressed against the balls to flatten a surface of the balls. A first mold compound then is injected into the mold cavity such that the mold compound surrounds exposed portions of the balls. The balls are removed from the platen and a first side of an integrated circuit die is attached to the balls. Die bonding pads on a second side of the die are electrically connected to respective ones of the balls surrounding the die, and then the die, the electrical connections, and a top portion of the conductive balls is encapsulated with a second mold compound.