WIRE BONDS ELECTRICAL CONDUCTORS

Brand Owner (click to sort) Address Description
ERICO Erico International Corporation 31700 Solon Road Solon OH 44139 WIRE BONDS AND ELECTRICAL CONDUCTORS FOR ELECTRICAL APPARATUS AND MACHINES;
ERICO ELECTRIC RAILWAY IMPROVEMENT CO., THE 6005 CARNEGIE AVENUE, S.E. CLEVELAND OH WIRE BONDS AND ELECTRICAL CONDUCTORS FOR ELECTRICAL APPARATUS AND MACHINES;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A high density electronic circuit for use in an implantable stimulation device that comprises a flexible substrate that has the advantage of integrating "chip-and-wire" microelectronic circuits and flexible interconnections that are adapted to conform to the body compatible housing into a single structure. The flexible substrate has die attach pads, each die attach pad having a set of wire bond pads therearound, each wire bond pad being connected to conductors formed within the substrate according to circuit function. A plurality of chip-and-wire integrated circuit (IC) chips are mounted by epoxy die attachment on the die attach pads, each IC chip has a plurality of contact pads formed on a top surface thereof, and gold wire bonds electrically connect the plurality of contact pads to the wire bonds pads. The wire bonds include a primary bond and, optionally, a safety bond for reinforcement. Other techniques are disclosed to enable the use of the gold wire bonds on a flexible substrate.