Brands and Their Owners
Welcome to the Brand page for “DIRECT PRESSED DIE TECHNOLOGY”, which is offered here for The mark consists of a stylized chevron above a horizontal line to the left of the stylized wording direct pressed die technology.;electronic components for electronic devices using integrated circuit cards; power transformers; voltage converters; voltage regulators; semiconductor devices; semiconductor components, particularly discrete and integrated semiconductor devices; transistors, particularly bipolar transistors; field-effect transistors and power transistors; diodes, particularly power diodes; thyristors, particularly power thyristors; power semiconductor modules; power semiconductor modules with power semiconductor components; power semiconductor modules with pressure device for electrical contacting of substrates; electric connecting elements and power semiconductor devices; power semiconductor modules with printing devices for thermal bonding of substrates, connecting elements and power semiconductor devices; unit converters with power semiconductor modules, with other electrical and electronic components and power converter systems built from these unit converters;color is not claimed as a feature of the mark.;direct pressed die technology;.
Its status is currently believed to be active. Its class is unavailable. “DIRECT PRESSED DIE TECHNOLOGY” is believed to be currently owned by “Semikron International GmbH”.
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SEMIKRON INTERNATIONAL GMBH
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The mark consists of a stylized chevron above a horizontal line to the left of the stylized wording DIRECT PRESSED DIE TECHNOLOGY.;Electronic components for electronic devices using integrated circuit cards; power transformers; voltage converters; voltage regulators; semiconductor devices; semiconductor components, particularly discrete and integrated semiconductor devices; transistors, particularly bipolar transistors; field-effect transistors and power transistors; diodes, particularly power diodes; thyristors, particularly power thyristors; power semiconductor modules; power semiconductor modules with power semiconductor components; power semiconductor modules with pressure device for electrical contacting of substrates; electric connecting elements and power semiconductor devices; power semiconductor modules with printing devices for thermal bonding of substrates, connecting elements and power semiconductor devices; unit converters with power semiconductor modules, with other electrical and electronic components and power converter systems built from these unit converters;Color is not claimed as a feature of the mark.;DIRECT PRESSED DIE TECHNOLOGY;
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