FindOwnerSearch
Brands and Their Owners
Welcome to the Brand page for “EPAD”, which is offered here for Plastic integrated circuit packaging which incorporates a die attach paddle which is depressed such that it is flush with the package bottom surface for thermal and electrical enhancement;electrical paddle;.
Its status is currently believed to be active. Its class is unavailable. “EPAD” is believed to be currently owned by “AMKOR TECHNOLOGY, INC.”
| Owner: |
AMKOR TECHNOLOGY, INC.
Owner Details |
|---|---|
| Description: |
PLASTIC INTEGRATED CIRCUIT PACKAGING WHICH INCORPORATES A DIE ATTACH PADDLE WHICH IS DEPRESSED SUCH THAT IT IS FLUSH WITH THE PACKAGE BOTTOM SURFACE FOR THERMAL AND ELECTRICAL ENHANCEMENT;ELECTRICAL PADDLE;
|
| Categories: | PLASTIC INTEGRATED CIRCUIT PACKAGING WHICH |