LOWTEMP DEBOND

Welcome to the Brand page for “LOWTEMP DEBOND”, which is offered here for Computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers;machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi-conductors; parts and equipment, fittings, bearings, chucks, joints and lubricating apparatus for the aforesaid machines and apparatus, included in this class;low temp debond;technical consultancy, for others, in relation to methods and devices in the field of semiconductor technology, research and design in the area of semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices and semiconductor processing technology; research and development, for others, in relation to methods and devices in the field of semiconductor technology; technical system engineering, for others, in relation to methods and devices in the field of semiconductor technology;.

Its status is currently believed to be active. Its class is unavailable. “LOWTEMP DEBOND” is believed to be currently owned by “IBG Immobilien und Beteiligungs; GmbH”.