Adcon Lab, Inc.

8

Chemical mechanical planarization (CMP) and cleaning related products used in semiconductor manufacturing to enable lower manufacturing costs and higher productivity and yield, namely, advanced abrasive products in both suspension and solid form in controlled shapes and particle size distributions, namely, cerium oxide, manganese oxide, silicon oxide, aluminum oxide, zirconium oxide and combinations or reaction products thereof;The stippling shown in the drawing is for shading purposes only to show three-dimensional depth.;

ADCON

Color is not claimed as a feature of the mark.;Chemical mechanical planarization (CMP) and cleaning related products used in semiconductor manufacturing to enable lower manufacturing costs and higher productivity and yield, namely, advanced abrasive compositions in both suspension and solid form in controlled shapes and particle size distributions, namely, cerium oxide, manganese oxide, silicon oxide, aluminum oxide, zirconium oxide and combinations or reaction products thereof;

CYPRESS-18

etching and cleaning preparations for use in semiconductor processing and fabrication of integrated circuitry;

NANOCERIA

Color is not claimed as a feature of the mark.;Suspensions comprised of liquids and particulates with a primary particle size in nanometer range, used for polishing, coating and surface preparation in the semiconductor and coating industries;