Advanced Chip Engineering Technology Inc.

3DSIP

THREE DSIP;Packaging of integrated circuits to the order and specification of others;The word(s) 3DSip or Sip have no meaning in a foreign language.;

AMEBA-BGA

Flash memory card; floating-point operation computer chip; blank electronic chip cards, blank smart cards; encoded electronic chip cards, namely, smart cards containing programming for storing personal data, namely, personal identification, bank information or health data; integrated circuits; memory cards, computer hardware; micro-circuits for silicon chips; micro-processors unit chips; structure semiconductor wafers; RAM (random access memory) card; ROM (read only memory) chips; semiconductor memory units; semiconductor chips; semiconductor power elements; semiconductor devices; silicon chips; silicon wafers; ULSI (ultra large scale integrated) chips; VLSI (very large scale integrated) chips; silicon wafers; and electronic components, namely, copper wafers, potassium arsenide wafers;

AMEBA-CSP

Flash memory card; floating-point operation computer chip; blank electronic chip cards, blank smart cards; encoded electronic chip cards, namely, smart cards containing programming for storing personal data, namely personal identification, bank information or health data; integrated circuits; memory cards, computer hardware; micro-circuits for silicon chips; micro-processors unit chips; structure semiconductor wafers; RAM (random access memory) card; ROM (read only memory) chips; semiconductor memory units; semiconductor chips; semiconductor power elements; semiconductor devices; silicon chips; silicon wafers; ULSI (ultra large scale integrated) chips; VLSI (very large scale integrated) chips; silicon wafers; and electronic components, namely copper wafers, potassium arsenide wafers;

AMEBA-LGA

Flash memory card; floating-point operation computer chip; blank electronic chip cards, blank smart cards; encoded electronic chip cards, namely, smart cards containing programming for storing personal data, namely personal identification, bank information or health data; integrated circuits; memory cards, computer hardware; micro-circuits for silicon chips; micro-processors unit chips; structure semiconductor wafers; RAM (random access memory) card; ROM (read only memory) chips; semiconductor memory units; semiconductor chips; semiconductor power elements; semiconductor devices; silicon chips; silicon wafers; ULSI (ultra large scale integrated) chips; VLSI (very large scale integrated) chips; silicon wafers; and electronic components, namely, copper wafers, potassium arsenide wafers;

AMEBA-SIP

Flash memory card; floating-point operation computer chip; blank electronic chip cards, blank smart cards; encoded electronic chip cards, namely, smart cards containing programming for storing personal data, namely personal identification, bank information or health data; integrated circuits; memory cards, computer hardware; micro-circuits for silicon chips; micro-processors unit chips; structure semiconductor wafers; RAM (random access memory) card; ROM (read only memory) chips; semiconductor memory units; semiconductor chips; semiconductor power elements; semiconductor devices; silicon chips; silicon wafers; ULSI (ultra large scale integrated) chips; VLSI (very large scale integrated) chips; silicon wafers; and electronic components, namely copper wafers, potassium arsenide wafers;

BGA

Flash memory card; floating-point operation computer chip; blank electronic chip cards, blank smart cards; encoded electronic chip cards, namely, smart cards containing programming for storing personal data, namely personal identification, bank information or health data; integrated circuits; memory cards, computer hardware; micro-circuits for silicon chips; micro-processors unit chips; structure semiconductor wafers; RAM (random access memory) card; ROM (read only memory) chips; semiconductor memory units; semiconductor chips; semiconductor power elements; semiconductor devices; silicon chips; silicon wafers; ULSI (ultra large scale integrated) chips; VLSI (very large scale integrated) chips; silicon wafers; and electronic components, namely copper wafers, potassium arsenide wafers;Color is not claimed as a feature of the mark.;BGA;

CSP

The design in the mark consists of two numerals, 9 is on top and the other at the bottom.;Flash memory card; floating-point operation computer chip; blank electronic chip cards, namely, blank smart cards; encoded electronic chip cards, namely, smart cards containing programming for storing personal data, namely personal identification, bank information or health data;integrated circuits; memory cards, namely, DRAM memory modules; computer hardware; micro-circuits for silicon chips; micro-processors unit chips; structured semiconductor wafers; RAM (random access memory) card; ROM (read only memory) chips; semiconductor mem;oryunits; semiconductor chips; semiconductor power elements; semiconductor devices; silicon chips; silicon wafers; ULSI (ultra large scale integrated) chips; VLSI (very large scale integrated) chips; copper wafers, potassium arsenide wafers;CSP;

LGA

Flash memory card; floating-point operation computer chip; blank electronic chip cards, blank smart cards; encoded electronic chip cards, namely, smart cards containing programming for storing personal data, namely personal identification, bank information or health data; integrated circuits; memory cards, computer hardware; micro-circuits for silicon chips; micro-processors unit chips; structure semiconductor wafers; RAM (random access memory) card; ROM (read only memory) chips; semiconductor memory units; semiconductor chips; semiconductor power elements; semiconductor devices; silicon chips; silicon wafers; ULSI (ultra large scale integrated) chips; VLSI (very large scale integrated) chips; silicon wafers; and electronic components, namely copper wafers, potassium arsenide wafers;Color is not claimed as a feature of the mark.;LGA;

PBP

Color is not claimed as a feature of the mark.;Packaging of integrated circuits to the order and specification of others;

PIP

Packaging of integrated circuits to the order and specification of others;

PSP

Packaging of integrated circuits to the order and specification of others;

SIP

Flash memory card; floating-point operation computer chip; blank electronic chip cards, blank smart cards; encoded electronic chip cards, namely, smart cards containing programming for storing personal data, namely personal identification, bank information or health data; integrated circuits; memory cards, computer hardware; micro-circuits for silicon chips; micro-processors unit chips; structure semiconductor wafers; RAM (random access memory) card; ROM (read only memory) chips; semiconductor memory units; semiconductor chips; semiconductor power elements; semiconductor devices; silicon chips; silicon wafers; ULSI (ultra large scale integrated) chips; VLSI (very large scale integrated) chips; silicon wafers; and electronic components, namely copper wafers, potassium arsenide wafers;Color is not claimed as a feature of the mark.;SIP;

UP

Assembly of integrated circuits for others;Color is not claimed as a feature of the mark.;Packaging of integrated circuits to the order and specification of others;Testing of integrated circuits for others;

UPTEK

Assembly of integrated circuits for others;UP TECHNOLOGY;Color is not claimed as a feature of the mark.;Packaging of integrated circuits to the order and specification of others;Testing of integrated circuits for others;

WSP

Color is not claimed as a feature of the mark.;Packaging of integrated circuits to the order and specification of others;