CENTROTHERM INTERNATIONAL AG

C

The mark consists of a red shaded square with a letter C in the center in white.;Hardware and software, downloadable and recorded, for operating surface treatment machines, transport machinery, thermal processing machines;Surface treatment machines for semiconductor surfaces, under vacuum using the CVD method, atmospheric processing or under exposure to plasma, by means of evaporating as well as machines for coating semiconductor surfaces, under vacuum using the CVD method, atmospheric method or under exposure to plasma; machinery for transport, namely, belt conveyors, chain conveyors, string conveyors and transport system using cantilever paddles; plasma- and heat radiation-based surface treatment machines, namely, Low pressure chemical vapor deposition (LPCVD) machines, Plasma-enhanced chemical vapor deposition (PECVD) machines, atmospheric pressure chemical vapor deposition (APCVD) machines, ma-chines for Diffusion, Oxidation, Annealing; installations and equipment for thermal processing or manufacturing processes, namely, coating furnaces, vacuum soldering machines, chemical vapor deposition (CVD) systems;The letter c is white, the box around the letter is red.;Construction, repair, installation and maintenance services, namely, of machines and machine tools and parts thereof, all for the manufacture and processing of solar cells being single tools or turnkey solutions, semicon-ductors, fibers and raw materials therefor; assembly, namely, installation of semiconductor devices, both at-mospheric and subatmospheric;CENTROTHERM;The color(s) red, and white is/are claimed as a feature of the mark.;Machines for thermal processing, namely, furnaces for the thermal treatment of semiconductors, solar-cells, fi-bers and other substrates and their thermal processing under vacuum; machines for the thermal treatment of sur-faces and objects, namely diffusion furnaces, conveyor furnaces, coating furnaces, annealing systems consist-ing of furnaces, wafer loading, resistive heating systems, radiation-based heating systems; radiation-based rapid heating systems consisting of machines for heat treatment and deposition and plasma-based machines for heat treatment and deposition and the combination thereof; installations and equipment for thermal pro-cessing or manufacturing processes, namely annealing systems consisting of furnaces, wafer loading, resis-tive heating systems, radiation-based heating systems;