DDP SPECIALTY ELECTRONIC MATERIALS US 8, LLC

AMBERCHROM

AMBER-CHROM;chromatographic resins and columns, adsorbtion materials, namely, carbonaceous adsorbents; and synthetic ion exchange resins for use in separation, filtration, and purification of liquids and solids;

AMBERJET

Amber Jet;ion exchange resins for use in water treatment;

AMBERLITE

SYNTHETIC OR CHEMICALLY-PREPARED RESINS;

AMBERLYST

Catalyst;

AMBERLYST

Ion Exchange Resin for Use in the Industrial Arts;

AMBERPACK

In the statement, column 1, lines 7, WATER FILTRATION AND is deleted, and line 9, AND REVERSE OSMOSIS FILTRATION UNITS is deleted.;AMBER PACK;Water treatment equipment, namely, ion exchange units, adsorption units, [ water filtration and ] purification units, wastewater treatment units [ and reverse osmosis filtration units ];

AMBERSEP

Inert Polymer Beads for Use in Ion Exchange Processes;

AMBERSEP

anion and cation resins with or without polymer beads for use in ion exchange processes; namely, for use in condensate polishing, water deionization in electric generating plants, and in the production of ultra-pure water for manufacturing semi-conductor devices;

AMBERSORB

SYNTHETIC ADSORBENTS, ESPECIALLY SYNTHETIC CARBONACEOUS ADSORBENTS;

AMBERTEC

Ion exchange resin; ion exchange resins for use in water treatment;

AMBERTEC

AMBER TECH;ION EXCHANGE RESIN FOR USE IN WATER TREATMENT;

CATAPOSIT

CHEMICALS USED FOR ELECTROLESS METAL PLATING;

CATAPREP

CHEMICALS USED FOR ELECTROLESS METAL PLATING;

CIRCUPOSIT

CHEMICAL COMPOSITIONS FOR PREPARING A SURFACE PRIOR TO ELECTROLESS METAL DEPOSITION;

COPPER GLEAM

Chemicals for use in the manufacture of integrated circuits, printed circuit boards, semiconductor packages and electronic components;COPPER;

CRIMSON

chemicals for metal plating nonconducting surfaces;

CUPOSIT

Metal Deposition Chemicals;

DURAPOSIT

FORMULATION FOR DEPOSITING ELECTROLESS METAL;

ELECTROPOSIT

Chemicals-Namely, Additives for Metal Plating Solutions;

ELECTROPOSIT

CHEMICAL ANALYZERS FOR CONTROLLING THE COMPOSITION OF METAL PLATING SOLUTIONS;ELECTRO-POSIT;

FSC

Chemical Solution-Namely, a Protective Coating for Use in Semiconductor Manufacture;

MF

Developers for Light Sensitive Photoresist Materials;

MICROPOSIT

Chemicals for Industrial Use-Namely, Chemical Materials Responsive to Activating Energy to Yield Images Including Ancillary Materials Such as Developers, Thinners, Solvents, and Removers;

NIPOSIT

CHEMICALS FOR PLATING A SUBSTRATE WITH AN ELECTROLESS METAL;

PEPR

electrodeposited photoresists used for the manufacture of electronic devices;

SPR

chemical products; namely, photosensitive resists used in the manufacture of printed circuit boards and semiconductors;

SYSTEM

LIGHT SENSITIVE COMPOSITIONS FOR THE MANUFACTURE OF ELECTRONIC DEVICES;