ENTHONE-OMI, INC.

ACHROLYTE

CHEMICAL COMPOUND FOR ELECTROPLATING AN ALLOY;

ARTFORM

ART FORM;chemical compositions for use in processes for the deposition of precious metals, including chemicals for treating the substrate before the precious metal is deposited;

ATTENUPLATE

Chemical Compositions for Use in Forming Coatings Having Electromagnetic Interference Shielding Properties on Substrates;

BRY-CAD

MATERIALS FOR CADMIUM ELECTROPLATING-NAMELY, ELECTROLYTES, SALTS AND ADDITION AGENTS THEREFOR;

CATHOCLEAR

Chemcials & Chemical Compositions for Use in Forming Coatings on Substrates by Electrodeposition and for Treating Substrates Before and/or After Coating;

DECOREX

Chemicals for Use in Palladium Electroplating Processes;

EBONOL

Chemical Compound for Oxidizing Ferrous Metal Articles;

EBONOL

COMPOSITION FOR BLACKENING METAL SURFACES;

ENFLUX

chemical compositions used as fluxes particularly in the manufacture of printed circuitboards;

ENLYTE

Chemical Compositions for Use in Processes for the Non-Electrolytic Deposition of Nickel-Namely, Chemical Compositions for Treating the Substrate Before and After the Nickel Is Deposited;

ENPASTE

chemicals for use in the manufacture of printed circuitboards in the electronic industry, including specifically, chemical compositions useful as solder paste;

ENTHOL

REAGENTS FOR CLEANING AND/OR DERUSTING METAL SURFACES;

ENVISION DPS

chemicals for use in the manufacture of printed circuitboards;DPS;

KARATCLAD

ELECTROLYTE FOR USE IN GOLD PLATING PROCESS;

NICROLYTE

CHEMICAL COMPOSITION FOR PLATING NICKEL/CHROMIUM ON STAINLESS STEEL;

NIMAX

chemicals for use in nickel plating baths;

NIRON

ORGANIC BRIGHTENING AGENTS FOR INTRODUCTION INTO ELECTROPLATING BATHS;

OMI

Chemical Compositions for Use in Processes Involving the Deposition of Precious and Non-Precious Metals on Metallic and Non-Metallic Substrates, Including Chemical Compositions for Treating Such Substrates Before and After the Metal is Deposited;

OMI

Chemical Compositions for Removing Coatings from Metallic and Non-Metallic Surfaces;

PLATANEX

ELECTROLYTE FOR USE IN PLATINUM PLATING PROCESS;

PROGRAMAT

OVERHEAD TRAVELING HOISTS FOR USE IN AUTOMATIC PLATING OF MATERIALS;

PROTONEX

ELECTROLYTE COMPOSITIONS USEFUL IN ELECTROPLATING;

PYR-AU-BOND

GOLD-BOND;GOLD PLATING COMPOSITION AND COMPONENTS THEREOF;

RUTHENEX

RUTHENIUM PLATING CHEMICALS;

SASSC

RECTIFIERS;

SOLDEREX

TIN-LEAD PLATING COMPOSITION AND COMPONENTS THEREOF;

SSC

RECTIFIERS;

SURFACES

House Organ;

TURBO

CHEMICALS FOR USE IN NICKEL PLATING COMPOSITIONS;

UDYFIN

RUST RETARDANTS AND CHROMATE AND ZINCATE CONVERSION COATINGS, ALL FOR USE IN THE METAL FINISHING INDUSTRY;CHEMICAL COMPOSITIONS NAMELY, COMPLEXING AGENTS APPLIED TO SOLUTIONS WHICH ARE APPLIED TO METALLIC SURFACES, SURFACE ACTIVE AGENTS, AND COMPOUNDS FOR REMOVAL OF DELETERIOUS SUBSTANCES, ALL FOR USE IN THE METAL FINISHING INDUSTRY;

UDYPREP

Chemicals and Chemical Compositions for Surface Conditioning of Substrates-Namely, Acid Salts, Pickling Agents, Surface Activators and Substances for Removing Deleterious Materials;

UDYSORB

CHEMICAL FILTERING COMPOSITION IN THE NATURE OF ACTIVATED CARBON;

ULTRACHROME

CHEMICAL COMPOSITION FOR PRODUCING CHROMIUM PLATING BATHS;

ZINCROLYTE

Zincro-Light;chemicals for use in the plating of zinc and zinc alloys;