Hesse GmbH

HESSE

Electric welding machines that attach chips and electronic components to the substrate using ultrasonic vibration; ultrasonic welding heads in the nature of machines parts for electric welding machines that operate using ultrasonic vibration; electric welding machines that use thermosonic bonding to attach chips and electronic components to the substrate; welding and soldering equipment, namely, welding electrodes; machines for the assembly of semiconductor components; memory chip manufacturing machines; machines for the production of semiconductors; semiconductor wafer processing equipment; bonding machines in the nature of machines that mount a chip;

LASERSONIC

Machines for the production of semiconductors; semiconductor wafer processing equipment; memory chip manufacturing machines; machines for the assembly of semiconductor components; electric welding and electric soldering equipment; electric thermal contact welding machines; ultrasonic welding heads; ultrasonic welding machines;LASER SONIC;