I3 ELECTRONICS, INC.

COREEZ

Printed circuit boards and chip carriers, and instructional manuals sold therewith;CORE EASE;

COREEZ

Custom manufacture of printed circuit boards and chip carriers for others;Printed circuit boards and chip carriers, and instructional manuals sold therewith;Publications, namely, product specification sheets and process specification sheets in the field of printed circuit boards and chip carriers;CORE EASY;Color is not claimed as a feature of the mark.;

DRICLAD

dielectric sheets and metal laminated dielectric sheets and related documentation sold as a unit therewith for use in printed circuit boards;DRY CLAD;

ENDICOTT INTERCONNECT

Custom manufacturing services for printed circuit boards and electronic components for use with printed circuit boards, namely capacitors, resistors, inductors, coils, diodes, transistors, integrated circuits, chip carriers, connectors, sockets, switches, crystals, relays, jumpers, thermistors, optoelectronics, modules, dual inline packages consisting of capacitors, resistors, diodes and transistors, and card-on-board assemblies;Printed circuit boards; electronic components for use with printed circuit boards, namely capacitors, resistors, inductors, coils, diodes, transistors, integrated circuits, chip carriers, connectors, sockets, switches, crystals, relays, jumpers, thermistors, optoelectronics, thermal conductor modules, dual in line packages consisting of capacitors, resistors, diodes and transistors, and card-on-board assemblies; electrical connectors and parts therefore; artwork master films, namely glass masters for defining circuit patterns on circuitized substrates, namely printed circuit boards; and computer software for use in designing, developing and manufacturing printed circuit boards and electronic components for use with printed circuit boards, namely capacitors, resistors, inductors, coils, diodes, transistors, integrated circuits, chip carriers, connectors, sockets, switches, crystals, relays, jumpers, thermistors, optoelectronics, thermal conductor modules, dual in line packages and card-on-board assemblies;Drilling machines, punching machines, routing machines, trimming machines, doweling machines, imaging machines, laminating machines, plating machines, etching machines, testing machines and inspection machines for manufacturing printed circuit boards;INTERCONNECT;Development and design for others for services for printed circuit boards and electronic components for use with printed circuit boards, namely capacitors, resistors, inductors, coils, diodes, transistors, integrated circuits, chip carriers, connectors, sockets, switches, crystals, relays, jumpers, thermistors, optoelectronics, modules, dual in line packages consisting of capacitors, resistors, diodes and transistors, and card-on-board assemblies;

ENDICOTT INTERCONNECT

The mark consists of two adjacent linking shapes, one of a somewhat E configuration and the other of a somewhat U configuration, to the left of the wording ENDICOTT INTERCONNECT.;Printed circuit boards; organic printed circuit board substrate materials in the nature of multilayer IC boards for use in computer processors and the like; custom testing machines and inspection machines for manufacturing printed circuit boards and other microelectronics; current induced thermal cycling (CITC) testers; field programmable gate array (FPGA)-based high performance computing accelerator platforms; portable electron volt cadmium zinc telluride (eV-CZT) spectrometer engines in the nature of radiation and explosive detectors designed for handheld instruments; fully integrated electron volt cadmium zinc telluride (eV-CZT) detectors/MCA systems comprising sensors and detectors; lab probes for detecting radiation and/or explosive devices, single point extended area radiation detectors; 16-channel testing platforms for pixelated spectroscopy detector designs and geometries; 1-channel, high count rate, electron volt cadmium zinc telluride (eV-CZT) sensor systems comprising sensors and detectors for industrial imaging applications; ultra-low noise charge-sensitive preamplifiers; electronic components for use with printed circuit boards, namely, capacitors, resistors, inductors, coils, diodes, transistors, integrated circuits, chip carriers, connectors, sockets, switches, crystals, relays, jumpers, thermistors, optoelectronics, thermal conductor modules, dual inline packages consisting of capacitors, resistors, diodes and transistors, and card-on-board assemblies; electrical connectors and parts therefor; artwork master films, namely, glass masters for defining circuit patterns on circuitized substrates, namely, printed circuit boards; and computer software for use in designing, developing and manufacturing printed circuit boards and electronic components for use with printed circuit boards, namely, capacitors, resistors, inductors, coils, diodes, transistors, integrated circuits, chip carriers, connectors, sockets, switches, crystals, relays, jumpers, thermistors, optoelectronics, thermal conductor modules, dual inline packages, and card-on-board assemblies; components for use with printed circuit boards, semiconductor substrate and packaging materials in the nature of multilayer IC boards for use in computer processors and the like, automated testing machines and inspection machines for manufacturing printed circuit boards and electronic components for use with printed circuit boards, medical imaging devices, gamma ray detectors and gamma ray spectroscopy systems, and wearable medical diagnostic and therapeutic devices;Color is not claimed as a feature of the mark.;INTERCONNECT;Development of printed circuit boards; assembly and testing of printed circuit boards and semiconductors; electronic computer systems integration for high performance computing (HPC), art and design (A and D), automated test equipment (ATE), medical, imaging, telecomm, microwave, and industrial markets; semiconductor assembly and test services; advanced laboratory and engineering services, namely, reliability engineering, material science, and failure analysis, thermal and mechanical modeling, product qualifications testing, and mechanical and fragility testing; gamma-ray spectroscopy testing, special nuclear material identification, research in the field of health physics, geological research in the nature of site monitoring; gamma-ray spectroscopy testing, and industrial gauging in the nature of calibration of nuclear density gauges; lab spectroscopy testing, non-medical x-ray imaging, detector development activities, namely, detection of radiation and/or explosive devices; liquid level gauging, fill level gauging, and web/thickness gauging, namely, gauge calibration; x-ray inspection of physical features, case inspection of physical features; developing and designing services for others of printed circuit boards and electronic components for use with printed circuit boards, namely, capacitors, resistors, inductors, coils, diodes, transistors, integrated circuits, chip carriers, connectors, sockets, switches, crystals, relays, jumpers, thermistors, optoelectronics, modules, dual inline packages consisting of capacitors, resistors, diodes and transistors, and card-on-board assemblies; developing, designing and testing for others of printed circuit boards and electronic components for use with printed circuit boards, namely, capacitors, resistors, inductors, coils, diodes, transistors, integrated circuits, chip carriers, connectors, sockets, switches, crystals, relays, jumpers, thermistors, optoelectronics, modules, dual inline packages consisting of capacitors, resistors, diodes and transistors, and card-on-board assemblies; reliability engineering services, thermal and mechanical modeling services for printed circuit boards and components for use with printed circuit boards, semiconductor substrate and packaging materials, and wearable medical diagnostic and therapeutic devices;