Nextreme Thermal Solutions, Inc.

NEXTREME THERMAL SOLUTIONS

Custom manufacturing for others in the field of thermal management components and modules, namely thin-film thermoelectric devices and conventional thermoelectric devices for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive;The mark consists of the words Nextreme Thermal Solutions with the letters NE and the upper portion of the X appearing in red; the lower portion of the X and the letters TREME appearing in blue, and the words Thermal Solutions appearing in red.;Thermal management components and modules, namely conventional thermoelectric modules; thin-film thermoelectric coolers and thermally active copper pillar bumps containing a thin film thermoelectric nanomaterial, for applications in the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries; thermal power generation and energy harvesting components and modules, namely, thermoelectric coolers and thermally active copper pillar bumps containing a thin-film thermoelectric nanomaterial, for applications in the semiconductor, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries; thermal management components and modules, namely thin-film thermoelectric device namely, thermoelectric coolers and thermally active copper pillar bumps containing a thin-film thermoelectric nanomaterial, and conventional thermoelectric device namely, conventional thermoelectric modules, for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical biomedical, bio-tech, defense aerospace, and automotive industries; and thermal power generation and energy and harvesting components and modules, namely, thermo electric coolers and thermally active copper pillar bumps containing a thin-film thermoelectric nanomaterial, and conventional thermoelectric device namely, conventional thermoelectric modules, for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries;NEXT EXTREME THERMAL SOLUTIONS;The applicant claims color as a feature of the mark, namely, red and blue.;Thermal Solutions;Providing thermal management solutions, namely design, development and testing of thermal management components and modules, namely thin-film thermoelectric devices and conventional thermoelectric devices for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries; and providing thermal power generation and energy harvesting solutions, namely design, development and testing of thermal management components and modules, namely thin-film thermoelectric devices and conventional thermoelectric devices for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries;