NOVASIC

NOVASIC

Treatment of wafers of semiconductor or piezoelectric materials or oxides relating to machining operations, namely, processing for conducting cuts, meplats, bevels; treatment of wafers of semiconductor or piezoelectric materials or oxides relating to for surface preparation operations, namely, lapping, precision grinding, mechanical and chemical mechanical (CMP) polishing, cleaning, laser marking operations; other surface treatments, used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; surface characterization process, namely, topography, roughness and chemical analysis; structure characterization method, namely, morphology and crystal display; all these services being provided in the field of semiconductor or piezoelectric materials or oxides for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling;Single-layer or multilayer wafers of semiconductor or piezoelectric materials or oxides having received different machining operations, namely, operations for conducting cuts, meplats, bevels; single-layer or multilayer wafers of semiconductor or piezoelectric materials or oxides having received different surface preparation operations ready for epitaxy or bonding, namely, lapping, precision grinding, mechanical and chemical mechanical (CMP) polishing, cleaning, laser marking operations; single-layer or multilayer wafers of semiconductor or piezoelectric materials or oxides having received different surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components; all these goods being used in precision grinding, mechanical and chemical mechanical polishing (CMP) operations and other surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling;Testing and tests of machining techniques, namely, technical tests and trials for conducting cuts, meplats, bevels; testing and tests of surface preparation techniques, namely, technical testing and testing of lapping, precision grinding, mechanical and chemical mechanical polishing (CMP), cleaning, laser marking; testing and technical tests of other surface treatments in the field of materials used to for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; research and development for new products; research and development of new consumable products used in machining operations, namely, operations for conducting cuts, meplats, bevels; research and development of new consumable products for use in surface preparation operations, namely, lapping, precision grinding, mechanical and chemical mechanical (CMP) polishing, cleaning, laser marking operations; research and development of new consumables used in other surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; assistance and support or technical advice for conducting machining operations, namely, operations for conducting cuts, meplats, bevels; assistance and support or technical advice for conducting surface preparation operations, namely, lapping, precision grinding, mechanical and chemical mechanical (CMP) polishing, cleaning, laser marking operations; assistance and support or technical advice for conducting other surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; assistance and support or technical advice for surface characterization, namely, topography, roughness and chemical analysis; assistance and support or technical advice for structure characterization, namely, morphology and crystallography; all these services being provided in the field of semiconductor or piezoelectric materials or oxides for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding;

STEPSIC

CUTTING, MACHING FOR OTHERS, LAPPING, POLISHING, SURFACE TREATMENT IN THE DOMAIN OF RELATED MATERIALS NAMELY SILICON CARBIDE AND SILICON CARBIDE PLATES;STEP SILICON CARBIDE;Color is not claimed as a feature of the mark.;