Semikron International GmbH

DIRECT PRESSED DIE TECHNOLOGY

The mark consists of a stylized chevron above a horizontal line to the left of the stylized wording DIRECT PRESSED DIE TECHNOLOGY.;Electronic components for electronic devices using integrated circuit cards; power transformers; voltage converters; voltage regulators; semiconductor devices; semiconductor components, particularly discrete and integrated semiconductor devices; transistors, particularly bipolar transistors; field-effect transistors and power transistors; diodes, particularly power diodes; thyristors, particularly power thyristors; power semiconductor modules; power semiconductor modules with power semiconductor components; power semiconductor modules with pressure device for electrical contacting of substrates; electric connecting elements and power semiconductor devices; power semiconductor modules with printing devices for thermal bonding of substrates, connecting elements and power semiconductor devices; unit converters with power semiconductor modules, with other electrical and electronic components and power converter systems built from these unit converters;Color is not claimed as a feature of the mark.;DIRECT PRESSED DIE TECHNOLOGY;