SILICON GENESIS CORPORATION

ASSET

engineering services;

BEAMSAW

ELECTRO-MECHANICAL CUTTING DEVICE;BEAM SAW;

POLYMAX

Manufacture to the order and/or specification of others of equipment and systems for silicon, III-V and II-VI compounds in connection with photovoltaic, semiconductor, optoelectronic applications using process equipment, semiconductor manufacturing machines and systems for wafering and for manufacture of devices, namely, photovoltaic, integrated circuits and optoelectronics;Equipment and systems, namely, semiconductor manufacturing machines and semiconductor wafer processing equipment for the manufacture of silicon, III-V and II-VI compounds for wafering and manufacturing of devices, namely, photovoltaic, integrated circuits and optoelectronics modules;Installation and maintenance of equipment and systems, namely, semiconductor manufacturing machines and semiconductor wafer processing equipment for the manufacture of silicon, III-V and II-VI compounds for wafering and manufacture of devices, namely, photovoltaic, integrated circuits and optoelectronics modules;POLY MAX;Development, design and testing for others of equipment and systems, namely, semiconductor manufacturing machines and semiconductor wafer processing equipment for the manufacture of silicon, III-V and II-VI compounds for wafering and manufacture of devices, namely, photovoltaic, integrated circuits and optoelectronics modules;

PROTONIC-MODE

CUSTOM MANUFACTURE AND PROCESSING OF SUBSTRATES FOR OTHERS;SUBSTRATES, NAMELY, CONDUCTIVE, SEMI-CONDUCTIVE AND NON-CONDUCTIVE WAFERS AND LAMINATED MULTI-LAYER WAFERS;PRO TONIC MODE;

SIGEN

substrate, namely, a conductive, semi-conductive, or non-conductive material, used for the manufacture of articles such as semiconductor wafers, disks, integrated circuit devices, flat panel displays, piezoelectronic devices, photonic devices, microelectromechanical systems, sensors, actuators, solar cells, biological and biomedical devices, and the like;

SIGEN SILICON GENESIS

ENGINEERED SUBSTRATE PROCESSING AND AUTOMATED HANDLING EQUIPMENT AND COMPONENTS, NAMELY, PLASMA ION IMPLANTERS, SURFACE FINISHERS, PLASMA ACTIVATORS, BONDERS, SUBSTRATE SEPARATORS AND CLEANERS; AND COMPUTER SOFTWARE SOLD AS A UNIT AND USED IN ASSOCIATION THEREWITH;Color is not claimed as a feature of the mark.;LICENSING OF PATENTED TECHNOLOGY;SILICON;SCIENTIFIC RESEARCH AND DEVELOPMENT; PRODUCT RESEARCH AND DEVELOPMENT;

SILICON GENESIS

substrate, namely, a conductive, semi-conductive, or non-conductive material, used for the manufacture of articles such as semiconductor wafers, disks, integrated circuit devices, flat panel displays, piezoelectronic devices, photonic devices, microelectromechanical systems, sensors, actuators, solar cells, biological and biomedical devices, and the like;

SPLIT

Semiconductor manufacture services for producing substrates such as silicon wafers, silicon-on-insulator wafers and silicon-on-silicon wafers;Semiconductor substrates, namely, silicon wafers, silicon-on-insulator wafers and silicon-on-silicon wafers;

WAFERS FOR ADVANCED DEVICES

SUBSTRATE MANUFACTURING AND PROCESSING SERVICES;